Pb-Free Component & Board Finish Reliability
- Evaluation of Pb-Free Component & Board Finish Reliability (December 19, 2012)
- This FInal Report is for iNEMI members only.
Statement of Work
Statement of Work (Version 18.0, 6/23/08)
The transition to Pb-free solder alloys introduces new concerns regarding solder joint reliability. The implementation of alternative surface finishes for circuit boards and package substrates/leadframes compounds these reliability concerns. Although multiple studies are investigating the impact of Pb-free solder and alternative board finishes on board-level temperature cycling lifetime, few studies have dealt with the impact of these new material sets on solder joint reliability.
Scope of WorkComparative reliability testing will be conducted on Pb-free components assembled on test boards. Test board assemblies will be configured to evaluate multiple component surface finishes and 2 circuit board surface finishes. The reliability testing will be conducted with mechanical testing - with and without aging. Mechanical testing will consist of 4-point monotonic bend testing (IPC/JEDEC-9702) and drop testing.
The component surface finishes to be evaluated are listed below:
- Electrolytic Ni/Au
- Electroless Ni/Au (ENIG)
- SnAgCu solder over Cu
- Matte Sn over Cu
- Matte Sn over Ni/Cu
- SnBi over Cu
- Electrolytic NiAu
- Organic Solderability Preservative (OSP)