Call for Participation Webinar

Call-for-participation presentation: Board-Level Optical Interconnect Performance in Immersion-Cooled Environments project (April 25, 2023) 
 

Statement of Work & Project Statement 

• Statement of Work (SOW) v1.0 (February 21, 2022)

• Project Statement (PS) v1.0 (February 23, 2023)
  
  NOTE: this is a fast turnaround project in which non-members can participate for a fee. For additional details please contact Grace O'Malley (gomalley@inemi.org).

Project Motivation

• Immersion cooling is gaining strong traction as a means of disruptive thermal management in HPCs and data centers.
• On-board optics are gaining importance through co-packaged optics and mid-board optics applications.
• There is insufficient understanding of how optical interconnect components will perform in immersion-cooled environments.

Objectives

• To investigate and evaluate different on-board optical components and interconnect solutions in different immersion-cooled environments including single phase and dual phase.
• To understand how design factors of interconnect components affect performance in an immersion environment.

Strategy/Approach

• Evaluate performance and properties of optical components, assemblies and interconnect immersed in variety of immersion cooled environments under realistic conditions (temperature, time, etc.). 
• Develop an on-board optical ecosystem demonstrator that includes a comprehensive variety of different on-board/mid-board connector and cable solutions and facilitates measurement of performance during immersion.
• Evaluate optical interconnect performance with the demonstrator immersed in typical coolants under realistic conditions.
• Longer term — report to standards bodies (IEC, ISO, ITU)

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