Impact of Low CTE Mold Compound on Second-Level Board Reliability Project, Phase 2
Section: Packaging

Project Leader

Richard Coyle, Nokia Bell Labs

Statement of Work & Project Statement


Phase 1 focused on collecting data from the project team and industry regarding reliability issues associated with the transition to lower CTE mold materials. The detailed experiment design and FEM approach for Phase 2 will be optimized based on the input and results from Phase 1.


Grace O'Malley