New Packaging Technology Qualification Methodology
Section: Packaging

Project Leaders

Feng Xue, IBM

Curtis Grosskopf, IBM

End-of-Project Webinar

End-of-project webinar presentation (February 19, 2020)

Statement of Work & Project Statement 


  • New package technologies are qualified using procedures and test conditions based on past experience with the most similar technology previously qualified.
    • While previous experience is important to consider, it cannot be the only criterion.
    • Relying too much on experience may result in overlooking new failure modes and/or new wear out mechanisms.
    • Current test standards may not capture the reliability risk in the new package, or may overstress the technology in the new package.
  • Lack of understanding of the assembly processes, application environments, and use conditions of all potential end-users (vs targeted end-users) poses challenges when developing the appropriate reliability test plan for new package/materials. For example:
    • Test plan only focuses on standard test methodology or complies with the requirements of a few key customers.
    • For new technologies field knowledge (failures, issues, etc.) cannot be fed back into the test plan.
    • For new materials/package development, test plan completeness is always questionable.
    • Proceeding quickly to device qualification in the new package may delay determination of root cause for technology issues for the new package.
    • Little effort by industry to come out with a new test standard for new packaging technologies.

Purpose of Project

The purpose of this project is to develop a methodology for qualifying new packaging technology to address the gaps resulting from:

  • Lack of understanding of assembly processes.
  • Lack of understanding of the interactions of the materials and components within the new package.
  • Lack of understanding of the application environment.
  • Lack of understanding of the use conditions of all potential end-users.
  • Lack of understanding how variations of the packaging and manufacturing process could affect product quality and reliability.

Papers & Presentations


Masahiro Tsuriya