Package Warpage Prediction and Characterization, Phase 5

2022 Project Leadership Award

Congratulations to the Package Warpage Prediction and Characterization, Phase 5 project team for receiving a 2022 iNEMI Project Leadership Award. These awards recognize projects that have demonstrated superior performance of electronics manufacturing practices, provided solutions that enable significant technology and business results and/or had a positive impact on the electronics manufacturing value chain and its ecosystem. The project team members are:

  • Philip Chang, CoreTech
  • Ryan Curry, Akrometrix
  • Chih Chung Hsu, Coretech
  • Saskia Huber, Fraunhofer IZM
  • Ron Kulterman, Flex
  • Wei Keat Loh, Intel
  • Kei Murayama, Shinko Electric Industries
  • Kang Eu Ong, Intel
  • Arvind Purushotaman, ANSYS
  • Pierre-Louis Toussaint, Insidix
  • Makoto Tsukahara, Shinko Electric Industries 
  • Olaf Wittler, Fraunhofer IZM
  • Tatsuro Yoshida, Shinko Electric Industries

End-of-Project Webinar

Presentation: End-of-Project Webinar (December 14 & 15, 2021)

Statement of Work & Project Statement


The industry relies on the use of simulation tools, such as finite element model and analytical equation, to refine design options to achieve high confidence predictions. Current package warpage modeling is not adequate to satisfy the future needs of more complex and larger package constructions. Predicting package warpage is not straightforward. It requires significant consideration of properties, multi-physics, and boundary conditions. The use of different simulation tools may help understand the different physics assumptions. More work is needed to derive a reliable modeling framework for the electronics industry. 


Based on the modeling framework gap analysis and simulation case study in earlier iNEMI warpage project work, the team plan to further investigate organic substrate-based packages, conducting material properties characterization, including that of the mold compound and substrate raw material, to help understand the impact of curing process on eventual package warpage. The project scope falls into two portions:

  • Characterization of the warpage of advanced packaging technologies from real samples to track the typical range of warpage and trends.
  • Package warpage prediction – establish a reliable modeling framework to optimize package warpage simulation.


This project is part of the Warpage Characterization and Management Program. Warpage is a multi-physics and holistic issue which involves materials, design and manufacturing processes. Participation of researchers and engineers from package designers and manufacturers, EDA and simulation tool providers and equipment suppliers for warpage measurement, as well as industrial organizations and academic institutes is required. We welcome participation from the industry. Please refer to the project SoW for more information. 


"Predictive Modelling Methodologies for Bi-Material Wafer Warpage," presented by Jennan Wang (CoreTech System/Moldex3D), iNEMI session at ICEP (virtual event), May 13, 2021     

Presentation from the Call-for-Participation Webinar: Package Warpage Prediction & Characterization Project and High-Density Interconnect Socket Warpage Prediction and Characterization Project (July 24 & July 3, 2020) 


Haley Fu (