Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 3
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Project Leadership Award
Congratulations to the Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 3 project team for receiving a 2022 iNEMI Project Leadership Award. These awards recognize projects that have demonstrated superior performance of electronics manufacturing practices, provided solutions that enable significant technology and business results and/or had a positive impact on the electronics manufacturing value chain and its ecosystem. The project team members are:
- Billy Chung-Yu Cheng, Unimicron
- Jing-Sian Huang, Unimicron
- Alison Yu-Ting Lin, Unimicron
- Glenn Pomerantz, IBM
- Charles Reynolds, IBM
- Anna Lucy Santos, AT&S
- Neil Tang, AT&S
- Tom Wassick, IBM
- Feng Xue, IBM
- Channing Cheng-Lin Yang, Unimicron
- Zhihua Zou, Intel
End-of-Project Webinar
End-of-Project Webinar: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, Phase 3, August 26 & 27, 2021 (members only)
Statement of Work and Project Statement
Background
- The finer pitch substrate features used in new advanced packaging technologies such as SiP, 2.5D, etc., can make it difficult to validate designs and, as a result, impact yield assessment and quality validation of these new packages. There is a need to identify and characterize the capabilities of inspection technologies that can enable faster process development and higher yield in volume production. The Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology project was organized to address this need.
Phase 3 Focus
Phase 3 continues the study of inspection technologies begun in Phase 2, focusing on an organic test vehicle (TV).Objective
- Evaluate current inspection & measurement capabilities for fine pitch substrates that will be needed over the next five years.
- Fabricate TV on organic substrate with the same TV designs used in Phase 2.
- Understand and quantify the automatic optical inspection (AOI) capability limitations for the fine pitch patterns and defects on TVs.
- Compare with other metrologies, such as SEM or OGP, and identify the different capability results among the TV substrate.
- Start the review of TV designs and defect modes for 10um line/space down to 1um and determine implications for organic substrate fabrication.
- Over the longer term, analyze measurement data and compare the data with AOI-type equipment and other metrologies and TV substrate types.
Presentations
"Organic Panel Fine Pitch Circuit Pattern Inspection and Metrology Readiness," Feng Xue (IBM Singapore), EPTC, December 1-31 (virtual event) (members only)
End-of-Project Webinar: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, Phase 3, August 26 & 27, 2021 (members only)
Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, Phase 3 Call-for-Participation Webinar (March 5 2020)
Contact
Masahiro Tsuriya
m.tsuriya@inemi.org