Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 3
Section: Packaging

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Project Leaders


Feng Xue, IBM


Joe Zou, Intel


Charlie Reynolds, IBM

Project Leadership Award

Congratulations to the Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 3 project team for receiving a 2022 iNEMI Project Leadership Award. These awards recognize projects that have demonstrated superior performance of electronics manufacturing practices, provided solutions that enable significant technology and business results and/or had a positive impact on the electronics manufacturing value chain and its ecosystem. The project team members are:
  • Billy Chung-Yu Cheng, Unimicron
  • Jing-Sian Huang, Unimicron
  • Alison Yu-Ting Lin, Unimicron
  • Glenn Pomerantz, IBM
  • Charles Reynolds, IBM
  • Anna Lucy Santos, AT&S
  • Neil Tang, AT&S
  • Tom Wassick, IBM
  • Feng Xue, IBM
  • Channing Cheng-Lin Yang, Unimicron
  • Zhihua Zou, Intel


End-of-Project Webinar


End-of-Project Webinar: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, Phase 3
, August 26 & 27, 2021 (members only)

 

Statement of Work and Project Statement 


Background

  • The finer pitch substrate features used in new advanced packaging technologies such as SiP, 2.5D, etc., can make it difficult to validate designs and, as a result, impact yield assessment and quality validation of these new packages. There is a need to identify and characterize the capabilities of inspection technologies that can enable faster process development and higher yield in volume production. The Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology project was organized to address this need.


Phase 3 Focus

Phase 3 continues the study of inspection technologies begun in Phase 2, focusing on an organic test vehicle (TV).

Objective  
  • Evaluate current inspection & measurement capabilities for fine pitch substrates that will be needed over the next five years.
Strategy/Approach 
  • Fabricate TV on organic substrate with the same TV designs used in Phase 2.
  • Understand and quantify the automatic optical inspection (AOI) capability limitations for the fine pitch patterns and defects on TVs.
  • Compare with other metrologies, such as SEM or OGP, and identify the different capability results among the TV substrate.
  • Start the review of TV designs and defect modes for 10um line/space down to 1um and determine implications for organic substrate fabrication. 
  • Over the longer term, analyze measurement data and compare the data with AOI-type equipment and other metrologies and TV substrate types. 


Presentations

"Organic Panel Fine Pitch Circuit Pattern Inspection and Metrology Readiness," Feng Xue (IBM Singapore), EPTC, December 1-31 (virtual event) (members only)

End-of-Project Webinar: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, Phase 3
August 26 & 27, 2021 (members only)

Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, Phase 3 Call-for-Participation Webinar (March 5 2020)


Contact

Masahiro Tsuriya
m.tsuriya@inemi.org