Presentation: Wafer/Panel Level Package Flowability and Warpage End-of-Project Webinar (April 8 & 16, 2020)
“Numerical and Experimental Studies on Warpage of Flat Panel Packages,” Franco Costa (Autodesk), Classic Program Session: EPSDI Tailoring Polymers for Targeted Performance, SPE ANTEC 2021, May 17, 2021 (virtual event) (members only).
Statement of Work and Project Statement
- Statement of Work (Version #1.5; February 8, 2018)
- Project Statement (Version #1.5; February 8, 2018)
This project will:
- Identify key processing factors that impact flowability
- Establish factors from flowability that impact warpage
- Identify other material factors that impact post mold warpage to achieve higher yield in flow and warpage control for mold first WLP/PLP assembly processes.
Experimental Study of Panel Level Packaging Warpage, presented by Diane Ecoiffier (Insidix France), Electronics System-Integration Technology Conference (ESTC) 2020 virtual conference (September 15-18, 2020). paper presentation
Call-for-participation webinar (March 8, 2018)