Call-for-Participation Webinar

Presentation & recording from the call-for-participation webinar 
(January 17 & 18, 2022)

Statement of Work & Project Statement ​

• Statement of Work (Version 1.0; January 16, 2021)
• Project Statement (Version 1.0; January 16, 2021)

Background

Electronic packaging is made up of polymeric materials (dielectric, solder resist, core, mold, epoxy, etc.) that absorb moisture from the environment during substrate fabrication, packaging assembly and test processing. Absorbed moisture can cause material hygroscopic swelling and induces hygro-stress, which can lead to component warpage, delamination or popcorn failure during reflow or reliability tests.  

Knowledge of the moisture properties of polymeric materials (diffusivity, concentration, hygroscopic swelling) is critical for optimizing package material and design to minimize moisture-related failures. Hygro-swelling properties are not widely available due to a lack of measurement methods, and existing commercial measurement techniques have limited temperature capability (20-120°C).  

Project Focus

Presentations