Panel Level Package Fine Pitch Substrate Inspection/Metrology Project, Phase 4
Section: Packaging

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Project Leaders



Project Leader: Feng Xue, IBM


Co-Leader: Zhihua (Joe) Zou, Intel


Co-Leader: Charles Reynolds, IBM

Call-for-Participation Webinar

Webinar presentation (January 20, 2022)

Statement of Work and Project Statement 


Background

Heterogeneous SiP packages are popular as an electronic packaging solution. These packages require finer circuitry patterns designed within the substrate/interposer (lines and spaces <10um). Defect inspection and measurement capability using AOI (automatic optical inspection) on these fine pitch substrates/interposers impacts yield, throughput and reliability. At the same time, larger panel size and more layers on substrates demands increased AOI capability to accurately detect, characterize and reject the true defects without over-rejections. Finer trace width and spaces will need better AOI optics to reduce the field of view and depth of focus while addressing warpage issues and organic panel shrinkage. Therefore, it is critical to characterize the current capabilities of AOI metrologies as well as to understand the future trends in AOI measurement and inspection technology. 

 

Project Focus

This new iNEMI metrology project will study defect detection plus line width and space measurement for circuit patterns below 5um line space. By participating this project, organizations can better understand the current capabilities of AOI measurement and inspection systems and inspection, as well as technology trends for AOI solutions. The ultimate goal of this project is to drive the readiness of innovative AOI inspection systems to reduce the defect escape risk for finer pattern substrate and interposers. 


Presentations 


Previous Projects

Steps for Joining the Project

Please note: iNEMI membership is required to participate in this project.  

For iNEMI members:
Complete and sign the project statement and email to infohelp@inemi.org

For non-members:

Further Information

For additional information, please contact Masahiro Tsuriya (m.tsuriya@inemi.org).