Warpage Characteristics of Organic Packages, Phase 1 (Package Warpage Qualification Criteria)

Monday, January 9, 2023
by:

Section: Packaging

High Density Interconnect Socket Warpage Prediction and Characterization, Phase 1
Package Warpage Prediction and Characterization, Phase 5
Wafer/Panel Level Package Flowability and Warpage
Warpage Characteristics of Organic Packages, Phase 2
Warpage Characteristics of Organic Packages, Phase 3
Warpage Characteristics of Organic Packages, Phase 4
Warpage Characterization and Management Program
Package Warpage Prediction and Characterization Project, Phase 6
High Density Interconnect Socket Warpage Prediction and Characterization, Phase 2

Project Leaders

Wei Keat Loh, Intel

Robert Carson, Cisco

Current standard is not adequate to predict good yield results at 1st and 2nd level assembly
Measurement methods (dimensional and test) not common
Statement of Work - Package Qualification Criteria to Ensure Acceptable Warpage Performance for 2nd Level Assembly (Version 3.0; September 21, 2010)
Note that this project is the first phase of what later became known as the Warpage Characteristics of Organic Packages projects.

Define the qualification method and criteria; e.g., sample size, precondition, variations of material and processes (1st and 2nd level)
Establish measurement methods