PCB Characterization for CAF and ECM Failure Mitigation
Tuesday, July 26, 2022

Section: PCB & Laminates

Project Leaders

Juan Landeros, Intel & Terry Munson, Foresite

Call for Participation

Call-for-Participation Webinar Presentation (September 7 & 8, 2022)

Statement of Work & Project Statement

Statement of Work (V 1.0, April 5, 2022)
Project Statement (V 1.0, May 5, 2022)


CAF (conductive anodic filament) failures are an electrochemical migration (ECM) process causing short circuits within a PCB. Reduced via hole pitch and low loss resin systems (for high-speed and similar applications) have exacerbated the problem which often is only found in the field. The areas of concern this project will assess are: (1) scaling and integration of laser and mechanical drill features, (2) incoming quality measures of glass/resin systems, and (3) manufacturing process factors that may limit future targets and demands.

Project Focus

  • Utilize data collected to establish an improved understanding of laser and mechanical drill features. Assess opportunity to enable predictive methodology for laser and mechanical drill feature integration.
  • Characterize incoming glass and resin system quality methods. Develop an understanding of sources of variation that may influence CAF and ECM; roadmap risk for new material development.
  • Characterize process factors that contribute to CAF and ECM risk. Develop an understanding of process factors critical for new material development in support of PCB scaling advancements. 

Project Benefits

  • Lower design reliability risk through characterization and study of focused incoming material and process factors driving CAF.
  • Enable pitch scaling and higher density board technologies. Identify high risk PCB technology features.
  • Develop a better understanding of CAF through hardware failure analysis and build awareness of failure mechanisms.
  • Enable predictive methodologies for laser and mechanical drill features.
  • Reduce product qualification costs and associated timescales.

Steps for Joining the Project

Please note: iNEMI membership is required to participate in this project. Steps for joining the project follow.

For iNEMI members:
  • Complete and sign the Project Statement (above)
  • Email the completed statement to infohelp@inemi.org.  
For non-members: