Smart Manufacturing Data Management Best Practices for PCB Assembly
Monday, March 29, 2021
Section: Smart Manufacturing

Project Leader

Ranjan Chatterjee, Cimetrix


Statement of Work & Project Statement



For electronic assembly manufacturers, digitizing the factory floor by implementing machine-to-machine (M2M) as well as machine-to-host communications and closed-loop feedback is a key enabler to improving assembly line efficiency and yield. Today, equipment suppliers offer M2M communication solutions using their own equipment, software and proprietary algorithms. However, these supplier-specific solutions cannot be replicated or scaled in a manufacturing environment where diverse supplier equipment as well as legacy equipment are used. The electronic assembly supply chain is going through a rapid consolidation between semiconductor fabrication, OSAT and PCBA industries that requires a generic, scalable solution that enables implementation of smart PCB assembly into an existing, diverse manufacturing footprint, avoiding investment in new equipment and technology.

Project Objectives

The purpose of this project is to develop a generic reference data flow architecture and best practices for a typical electronics assembly line that can be shared with industry to enable efficient implementation of smart PCB assembly in a manufacturing environment where diverse supplier equipment is used. There will be three distinct phases: 

  • Phase 1: Develop the reference architecture and best practices, based on at least one use case that represents one key electronic assembly process step

  • Phase 2: Physical implementation of the use case using production equipment to validate best practices and demonstrate the ability to collect, analyze and act on data, in real time

  • Phase 3: Expand scope to a full PCBA line and demonstrate measurable assembly line performance improvement in terms of yield, output, uptime etc.





Mark Schaffer