Advancing Manufacturing Technology

5G/mmWave Materials Assessment and Characterization
Section: 5G Electronics

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Project Leaders


Say Phommakesone,  Keysight 

Richard Stephenson, EMD Group

Dr. Chang-Sheng Chen, ITRI 

Project Reports

Access Reports 1 & 2
Please note: these reports are for members only and require log-in.

  • 5G Materials Assessment and Characterization Project Report 1: Benchmark Current Industry Best Practices for Low Loss Measurements (November 2020)  
  • 5G Materials Assessment and Characterization Project Report 2: Benchmark Emerging Industry Best Practices for Low Loss Measurements (November 2020)

Call for Participation

SOW & Project Statement


Next-generation 5G communications solutions require ultra-low loss laminate materials and PCBs/substrates for efficient design and manufacturing. However, these materials pose challenges. For example, there is no consistent methodology for measuring transmission loss or Df/Dk, especially for higher frequencies (e.g., >30 GHz). Many different approaches are currently used, requiring different fixtures and test methods, sample preparation, and/or data analysis/extraction. 

Project Focus

The goal of this project is to develop a guideline/best practice for a standardized measurement  and test methodology that can be shared with industry and relevant standards organizations. Initial focus will be to benchmark current available test methods and provide pro/con analysis, identify gaps (if any) for extending test methods to 5G/mmWave frequencies, as well as develop reliable reference standard materials for set-up and calibration.

The project will have two distinct phases:
  • Phase 1: Develop technical guidelines and generate best practices for characterization of ultra-low loss laminate materials in the range of 5-100 GHz
  • Phase 2: Extend the guidelines to PCB/substrate level characterization 


5G/High Frequency Materials Characterization Challenges and Opportunities, Urmi Ray (iNEMI) American Ceramic Society’s Electronic Materials and Applications (EMA) virtual conference, January 22, 2021

Call-for-Participation Webinar Presentation (June 4 & 5, 2020)

Packaging Challenges & Opportunities for 5G Applications
Electronics Packaging Technology Conference (EPTC)
December 4, 2019; Singapore
iNEMI co-organized a session at EPTC that featured a diverse panel of speakers who outlined the key drivers and applications for 5G such as high-speed computing, smart phones, automotive, networking, IoT etc. The panel-led interactive session discussed many of the design and material challenges that 5G presents, including antenna-in-package (AiP) and beam-forming antenna module array with package-level integration, substrates and PCB fabrication requirements, material characterization, and measurement and test challenges. This session contributed to the development of iNEMI’s initiative on 5G mmWave material characterization and testing.

iNEMI 5G/mmWave Tech Topics Webinar Series



Urmi Ray