5G/mmWave Materials Assessment and Characterization
Section: 5G Electronics

Related Articles

Project Leaders


Say Phommakesone,  Keysight 

Richard Stephenson, EMD Group

Dr. Chang-Sheng Chen, ITRI 

End-of-Project Webinar 

Webinar presentation (includes link to recorded webinar)
Thursday, June 2, 2022 

Project Reports


Report 3

5G/mmWave Materials Assessment and Characterization Project Report 3: A Round Robin Study to Determine Measurement Accuracies of Commercial Resonator-Based Techniques (January 2022; members only)

Reports 1 & 2

Project Update (December 22, 2021)
Download the latest update

Statement of Work & Project Statement


Next-generation 5G communications solutions require ultra-low loss laminate materials and PCBs/substrates for efficient design and manufacturing. However, these materials pose challenges. For example, there is no consistent methodology for measuring transmission loss or Df/Dk, especially for higher frequencies (e.g., >30 GHz). Many different approaches are currently used, requiring different fixtures and test methods, sample preparation, and/or data analysis/extraction. 

Project Focus

The goal of this project is to develop a guideline/best practice for a standardized measurement  and test methodology that can be shared with industry and relevant standards organizations. Initial focus will be to benchmark current available test methods and provide pro/con analysis, identify gaps (if any) for extending test methods to 5G/mmWave frequencies, as well as develop reliable reference standard materials for set-up and calibration.

The project will have two distinct phases:

  • Phase 1: Develop technical guidelines and generate best practices for characterization of ultra-low loss laminate materials in the range of 5-100 GHz

  • Phase 2: Extend the guidelines to PCB/substrate level characterization 


5G/High Frequency Materials Characterization Challenges and Opportunities,” Urmi Ray (iNEMI), Electronic Materials and Applications (EMA) Conference, American Ceramic Association (January 22, 2021; virtual event). 

iNEMI Session at IMPACT
December 21, 2021 (Taipei, Taiwan)

"Reliability & Loss Properties of Copper Foils for 5G Applications," Ed Kelley (Isola Group)

Importance of Materials Characterization for 5G and Beyond,” Say Phommakesone (Keysight Technologies)

5G/mmWave Material Characterization” Chang-Sheng Chen (ITRI)

“Measuring Complex Permittivity for 5G/mmWave Materials,” Hanna Kähäri (Nokia), Session 3.1: Equipment and Materials for Enabling High Performance, Connecting Heterogeneous Systems Summit, September 1, 2021 (virtual event)

“Solving High Frequency Materials Characterization Challenges in 5G Electronics,” Urmi Ray (iNEMI), webinar sponsored by the International Wireless Industry Consortium (IWIC), June 16, 2021  

“5G/High Frequency Materials Test Challenges: Closing the Gaps via E2E Supply Chain Collaborative Innovation,” Urmi Ray (iNEMI), NIST Workshop: Securing the 5G Supply Chain through Measurement, Potential Adoption Paths for Measurements in 5G Hardware Security Session, May 19, 2021      
High Frequency Measurements Using Wafer Level Techniques: Measuring Low dK/dFMaterials from 1 GHz to 1 THz,” presented by Nathan Orloff (NIST), iNEMI session at ICEP, May 13, 2021 (virtual event).     

5G Electronics Challenges: High Frequency Materials Characterization, iNEMI Invited Session at the International Conference on Device Packaging, April 14, 2021 (virtual event)
Session Chair: Urmi Ray (iNEMI)
Presentations and speakers:

“Challenges for High Dk/Df Measurements,” Urmi Ray (iNEMI)
“Benchmarking Resonator based Low Dk/Df Material Measurements,” Richard Stephenson (EMD Electronics)
“Recent Developments of Resonator Measurements for Emerging Materials and Technologies,” Magorzata Celuch & Marzena Olszewska-Placha (QWED)
“High Frequency Measurements Using Wafer Level Techniques,” Nathan Orloff (NIST)
“Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements,” Say Phommakesone and Daisuke Kato (Keysight Technologies)

iNEMI Technical Session: 5G/High Frequency Materials Characterization Challenges and Opportunities, IPC APEX EXPO, March 12, 2021, moderated by Urmi Ray (iNEMI) March 12, 2021 

"High Frequency Measurements using Wafer Level Techniques," Nathan Orloff (NIST)
"Benchmarking Resonator Based Low Dk/Df Material Measurements," Michael Hill (Intel) and Malgorzata Celuch (QWED)  
"Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements," Say Phommakesone and Daisuke Kato (Keysight)

Call-for-Participation Webinar Presentation (June 4 & 5, 2020)

Panel Session: Packaging challenges & opportunities for 5G applications
Electronics Packaging Technology Conference (EPTC)
Moderator: Dr. Haley Fu, iNEMI
December 4, 2019; Singapore
iNEMI co-organized a session at EPTC that featured a diverse panel of speakers who outlined the key drivers and applications for 5G such as high-speed computing, smart phones, automotive, networking, IoT etc. The panel-led interactive session discussed many of the design and material challenges that 5G presents, including antenna-in-package (AiP) and beam-forming antenna module array with package-level integration, substrates and PCB fabrication requirements, material characterization, and measurement and test challenges. This session contributed to the development of iNEMI’s initiative on 5G mmWave material characterization and testing.

Introduction,” Haley Fu (iNEMI)
Antenna-in-Package (AiP) Technology for mmWave 5G Phased Array Chips,” Y.P. Zhang, FIEEE (Nanyang Technological University)
Shunichi Kikuchi (Fujitsu Advanced Technologies Limited)
5G related activity of Hitachi Chemical,” Toshihisa Nonaka, PhD (Packaging Solution Center Hitachi Chemical Co., Ltd.)
PCB Design and Fabrication Trends – Telecom, Networking & Computing,” Erkko Helminen (TTM Technologies)


iNEMI Tech Topic Series: 5G/mmWave

Packaging for mmWave Communications,” Professor Madhavan Swaminathan (Georgia Institute of Technology), March 11, 2021

Broad Dielectric Characterization of Polymers and Ceramics in the 5G Frequency Range,” Professor Michael Lanagan (Penn State), April 8, 2021

Standard Reference Materials for 5G and Microwave Materials at NIST,” Dr. Nathan Orloff (NIST), May 6, 2021

Enabling Thin Glass Solutions for 5G,” Aric Shorey (Mosaic Microsystems), July 15, 2021



Urmi Ray