Advancing Manufacturing Technology

2020 Second Quarter Newsletter
Thursday, April 2, 2020
Section: Quarterly Newsletters

Second Quarter 2020

Intel’s Mostafa Aghazadeh Elected Chairman of the iNEMI Board of Directors



Mostafa Aghazadeh of Intel has been elected Chairman of the iNEMI Board of Directors. Aghazadeh is Corporate Vice President and Director of Die Prep & Assembly Technology Development at Intel Corporation in Chandler, Arizona. He has served on the iNEMI Board for several years and replaces Jean-Luc Pelissier of Universal Instruments, who has served as Chair since 2018.


“Mostafa and I first worked together on the board when I was representing a member company, and have continued to do so since I took over as iNEMI’s CEO,” said Marc Benowitz. “He is a strong advocate for iNEMI and collaborative research. He has not only helped guide iNEMI during his years on the board but has also been a strong ambassador for the consortium throughout the electronics manufacturing supply chain. I look forward to working with him even more closely as chairman. I also want to thank Jean-Luc for his tremendously valuable partnership and leadership as Board Chair, and look forward to his continued contributions on the board.”


iNEMI Project Recommends Methodology for Qualifying New Packaging Technologies

iNEMI’s New Packaging Technology Qualification Methodology project, completed earlier this year, identified and developed a robust methodology for qualifying new packaging technologies for a broad range of applications. Their recently published report details the project team’s recommendations to address gaps identified in current test methods and qualification standards for advanced packaging technologies. The project team reviewed existing standards and conducted industry-wide surveys to gain a better understanding of the needs of the IC packaging industry with regards to developing, assessing, and eventually qualifying new package technologies and materials. Their recommendations for an improved methodology address the need for a stronger understanding of anticipated use conditions (including manufacturing and shipping) and the tools and best practices that should be leveraged to ensure consistency across the industry, enabling faster assessment of new materials and, ultimately, faster and more successful qualification of new packaging technologies. Read more



New Members

Welcome to our newest members.




iNEMI Roadmap Chapters Highlighted in a Series of Industry Webinars

iNEMI hosted a series of webinars in May and June to review highlights of select chapters from the 2019 Roadmap. Presentations from this series are available onlineChapters covered to date are:

  • Board Assembly
  • Flexible Hybrid Electronics
  • High-End Systems
  • Mass Data Storage
  • Optoelectronics
  • Organic PCB
  • Portable & Wireless
  • Smart Manufacturing
  • Sustainable Electronic

A webinar on Design Technologies is scheduled for July 8. It will cover two roadmap chapters — Modeling, Simulation & Design Tools and Thermal Management. For additional details.


New Projects Launching

iNEMI has several new projects launching. These projects address technical gaps in a broad range of areas, including 5G, smart manufacturing, sustainable electronics, packaging and optical interconnect. If you’re interested in joining any of these projects, please contact the project managers listed below.


5G/mmWave Materials Assessment and Characterization — This project is addressing a critical industry gap by developing guidelines/best practices for a measurement and test methodology that can be used to support next-generation 5G/mmWave communications solutions. The project team will benchmark current available test methods, identify any gaps for extending test methods to 5G/mmWave frequencies, and develop reliable reference standard materials for set-up and calibration. Contact: Urmi Ray (


Smart Manufacturing: Data Management Best Practices for PCB Assembly — For PCB assembly manufacturers, achieving machine-to-machine (M2M) communications and closed-loop feedback using existing equipment is a key enabler to improve assembly line efficiency and yield. This project will develop a generic reference data architecture and best practices for a typical electronics assembly line to enable efficient implementation of smart PCB assembly in a manufacturing environment where diverse supplier equipment is used. Contact: Kevin McGowan (  


Non-Physical Data Destruction — This fast turn project will focus on data center expectations for data sensitization at end of life (EOL). It will demonstrate the feasibility of effectively and securely destroying data from EOL storage drives without physically destroying the drive itself, making it possible to leverage new business opportunities to decrease EOL expenses and increase the value that can be recovered from storage media. Contact: Mark Schaffer ( 


Package Warpage Prediction and Characterization — Dynamic warpage characterization of electronic packages is critical for high-yield board assembly. This project will enable improvements in package warpage prediction tools and techniques, with a focus on two areas: (1) warpage characterization of the latest advanced packaging technologies to quantify typical warpage ranges and trends that the industry can expect when implementing these technologies, and (2) material properties characterization of mold compounds and substrate raw materials to help understand the impact of curing process on eventual package warpage. A call-for-participation webinar is scheduled on July 2/3. Contact: Haley Fu (

High Density Interconnect Socket Warpage Prediction and Characterization — This 
project will investigate the warpage of high density, large size array sockets and the impact of socket design and fabrication process on warpage. The project aims to: (1) develop socket warpage measurement guidelines and prediction methods, (2) determine the impact of molding and design on large size socket warpage and (3) explore warpage mitigation approaches in SMT assembly process. A call-for-participation webinar is scheduled on July 2/3. Contact: Haley Fu (


Best Practices for Expanded Beam Connectors in Data Centers — The increased use of fiber optic connectors in data centers is driven by performance needs. Their use impacts operating expense due to the cleaning and inspection required. Expanded beam connectors, while still requiring inspection and cleaning, have less sensitivity to contamination and scratches than other optical connectors, leading to reduced cleaning needs. To date, there is no industry standard defining cleaning methods for expanded beam connectors, and no guidelines for a cleaning process. This project will address these gaps by developing industry cleanliness guidelines for use in data centers, enabling wider adoption of the technology, and will examine potential operational expense reduction. A call-for-participation webinar is scheduled July 7.  Contact: Steve Payne (


iNEMI Recognizes Member Leadership

At the 2020 Council of Members meeting, iNEMI recognized several individuals for their leadership of iNEMI projects. They are: 

Srini Aravamudhan, Intel Corporation

Mike Bixenman, Kyzen Corporation

Tanja Braun, Fraunhofer IZM

Antonio Caputo, Intel Corporation

Lisa Dender, IBM

Curtis Grosskopf, IBM

Herb Holmes, Intel Corporation

Robin Hou, IBM

Ron Kulterman, Flex

Wei Keat Loh, Intel Corporation

Renn Chan Ooi, Intel Corporation

Charlie Reynolds, IBM

Wayne Rifer, Green Electronics Council (retired)

Charles Woychik, i3 Electronics

Feng Xue, IBM

The meeting also included reports from iNEMI’s Technology Integration Groups (TIGs) who shared their recent planning efforts and Technical Plans, along with their recommendations for new collaborative projects. Click here to access the meeting presentation (members only).


iNEMI Partners with SMTA on Technical Webinar Series

iNEMI and SMTA are co-hosting a series of free technical webinars that are open to industry. These webinars are focused on key topics in the industry and bring together leading experts to discuss key trends and challenges in electronics manufacturing. Webinars to date have included:

  • Thermal Fatigue Reliability of High-Performance Pb-free Solder Alloys
  • Quantifying Environmental Life Cycle Impacts for ICT Products: A Simpler Approach
  • Low-Temperature Solder: Enabling the Future
  • Proposed Testing Protocols to Align Connector Reliability with Application Requirements

Presentations from these webinars are available on the iNEMI website. Additional webinars are planned for July and August. Watch the iNEMI calendar for additional topics and dates. 


Impact of PCB Manufacturing, Design and Material on PCB Warpage

The smaller form factors and finer pitches found in today’s electronic products are driving the use of smaller components and thinner PCBs, which has led to PCB warpage issues in the surface assembly process. Warpage can negatively impact yield during the SMT process when the PCB experiences peak SAC soldering temperatures in excess of 240°C, creating potential solder joint reliability issues. Design is one way to control PCB warpage, but materials, thickness, post manufacturing bake, and different PCB processing conditions can also influence warpage. 


Very little work has been published evaluating the impact of fabrication on PCB warpage. iNEMI’s PCB Warpage Characterization and Minimization project was organized to further investigate ways to control warpage. The project team evaluated several factors to determine their effect on warpage, including PCB manufacturing, thickness of the PCB, post processing and shipping panel location within the manufacturing panel. This article discusses the project team’s findings. Read more.