Advancing Manufacturing Technology

Nov 2020 Newsletter
Tuesday, April 27, 2021
Section: Monthly Newsletters

Events and Publications

November 2020

Collaborative Projects

Technology Integration Groups (TIGs)

Packaging TIG Technical Sharing: Advanced Substrate Laminate Technologies (members only; November 25) - Laminate material technologies used in advanced substrates are critical for packaging innovation, especially with the growing trend toward heterogeneous integration. Join the November meeting of iNEMI's Packaging Technology Integration Group (TIG) where Masahisa Ose and Kenichi Ikeda (Showa Denko Materials Co. Ltd, formerly Hitachi Chemical) will discuss substrate laminate technology trends and challenges, along with identifying potential project collaboration opportunities. 

January Packaging TIG Technical Sharing - Mark your calendar for January 25, 2021. CT Ko (Unimicron) will share information about fan-out panel-level packaging for heterogeneous integration. Watch the iNEMI website for further details. (Note that there is no Packaging TIG meeting in December.) 

Packaging TIG Technical Sharing: Photonics Packaging Technology — Peter O'Brien (Tyndall National Institute) was the guest speaker for the October meeting of iNEMI's Packaging TIG. He presented an overview of the requirements and status of photonics packaging development, including technology trends and challenges, and addressed discussion on packaging manufacturing challenges. The presentation from that meeting is available to iNEMI members; contact Masahiro Tsuriya ( for a copy.

Get Involved with a TIG — Want the opportunity to influence the choice and direction of iNEMI projects in 2021? Then consider getting involved with an iNEMI Technology Integration Group (TIG). In these groups, expert colleagues from the iNEMI membership lead the discussion and definition of potential project areas. In addition to projects highlighted in the newsletter, the TIGs are currently reviewing additional project collaboration opportunities, e.g.:

  • The Packaging TIG is investigating RDL adhesion strength measurement issues,  challenges with low temperature solder for first-level interconnect, and modelling and simulation challenges for embedded components.
  • The Smart Manufacturing TIG is starting to look at security requirements and challenges.
  • The PCB & Laminates TIG is considering reliability testing of hybrid PCBs for RF applications.
  • The Board Assembly TIG is planning to extend the ongoing low temperature solder characterization and reliability work to investigate electromigration and other topics. 

iNEMI members are always welcome and encouraged to join any TIG. For further information please email or check the upcoming meeting schedules and contacts for each TIG. 

Call for Participation

iNEMI/SMTA Webinars

iNEMI/SMTA Technical Webinar Series: NIST on a Chip - A Revolution in Quantum Sensing — Barbara Goldstein (NIST) recently shared information on the NIST on a Chip program, which is revolutionizing metrology by miniaturizing the core measurement technologies of the National Institute of Standards and Technology (NIST) into a suite of quantum-based standards that never need to be taken off-line for calibration. Barbara provided an overview of this program and identified some of the opportunities it is enabling. 

Roadmap Activities

Advanced Packages and New 5G Technologies Will Drive Portable Products — Check out this article by Urmi Ray (iNEMI) in the November issue of Printed Circuit Design & Manufacturing/Circuits Assembly magazine. It covers highlights from the Portable & Wireless chapter of the iNEMI roadmap, including the impact of 5G.

iNEMI Roadmap Highlights Series  — Presentations are available from the two latest roadmap highlights webinars: 

  • Semiconductor Technologies — Dr. Paolo Gargini (IRDS) discussed the roadmap's assessment of the semiconductor industry, current challenges, risks, and novel and exciting exciting opportunities. 
  • Industrial Internet of Things (IIoT) — Joanne Friedman (Connektedminds) talked about technological advancements needed, and challenges that must be overcome, to fully realize the benefits of Industry 4.0.

Papers & Presentations

iNEMI Presentations at SMTA International —Presentations from two iNEMI project teams were among the on-demand presentations for this year's SMTA International virtual event and are now available on the iNEMI website:  [link pending]

  • iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes — Part VII: Mechnical Shock Test and Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA Components, Jagadeesh Radhakrishnan (Intel)   
  • Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony, Richard Coyle, Ph.D. (Nokia Bell Labs)

iNEMI Presentations from IMPACT-EMAP 2020  — This year's conference combined in-person and virtual sessions, and included two presentations from iNEMI's Warpage Characteristics of Organic Packages project team: 

  • Predictive Modelling Methodologies for Bi-material Strip Warpage, Jenn An Wang (CoreTech System / Moldex3D)
  • PCB Warpage Characterization and Minimization, Mike Huang (Wistron)