Power Devices Qualification Requirements and Technical Challenges — The Packaging Technology Integration Group (TIG) continues to move forward on identifying the critical packaging needs that can be addressed with collaborative projects. Most recently, the TIG invited Eric Swenson (IBM) to share information in an iNEMI member-wide webinar about power packaging trends and the need for understanding qualification requirements, especially with regards to emerging applications and new technologies. Power device packaging has unique needs/challenges and the TIG is now discussing potential project proposals in this key area. The TIG has already identified potential projects, including the adhesion strength metrology for fine pitch RDL traces, low temperature first-level interconnect materials and the simulation and modeling gaps for the thermal and electrical performances of advanced package technologies. Any member who would like a copy of Eric’s presentation and/or wants to participate in project discussions, please contact Masahiro Tsuriya (firstname.lastname@example.org).
TIG Updates — iNEMI members — if you want to get involved in one of the iNEMI TIGs and have a more direct influence on the project portfolio, check out the upcoming meeting schedule. Here are the latest updates from the PCB & Laminates and Sustainable Electronics TIGs:
PCB & Laminates — Several potential project areas are being considered, including mitigation of 5G signal loss due to PCB copper foil surface treatments, reliability testing of hybrid PCBs for high frequency applications, and mitigation of field failures due to pad cratering. For additional details, please contact Steve Payne (email@example.com).
Sustainable Electronics — Investigating two new potential projects with a focus on the realization of a circular electronics economy. Extended Reliability Assessment for Electronic Components and Eco-Design Leadership Best Practices for Sustainable Electronics were both presented at the recent iNEMI virtual workshop at EGG 2020, and there will be a follow-up webinar on September 30 (open to members and non-members) to further define the scope of each project. Please contact Mark Schaffer (firstname.lastname@example.org) for project and/or meeting information.
Call for Participation
Sign Up Now for New Projects — Several new projects and initiatives are still accepting additional participants. This is a great opportunity to get involved early and help define the project direction. Please contact email@example.com or the contacts listed for the projects.
Predictive Modelling for Bi-material Strip Warpage (September 30) — This webinar will report updated simulation results for the Warpage Characteristics of Organic Packages project. In Phase 4 of the project, the team saw inconsistencies in the results of modeling vs. experiments for Cu/mold bi-material strip warpage. Further simulations have been conducted to study the cure shrinkage properties and post mold cure (PMC) process. The results indicate that curing has significant impact on warpage amplitude and the PMC process does not affect warpage trends. The studies also demonstrate that simulation can capture warpage at high temperatures.
Value Recovery Project Article Published — The August 12 issue of MRS Energy and Sustainability features “The use of decision support tools to accelerate the development of circular economic business models for hard disk drives and rare-earth magnets.” This article provides an in-depth case study of work completed by iNEMI’s Value Recovery from Hard Disk Drives project. Congratulations to authors Kali Frost (Purdue University), Hongyue Jin (University of Arizona), William Olson (ASM International), Mark Schaffer (iNEMI), Gary Spencer (Geodis Reverse Logistics) and Carol Handwerker (Purdue) for an excellent article.
iNEMI/SMTA Technical Webinar Series — This technical webinar series, hosted by iNEMI and the Surface Mount Technology Association (SMTA), continued in August with “Non-Contact Additive Processes for Contemporary Electronics Production,” by Gustaf Martensson, Ph.D., Mycronic AB and Royal Institute of Technology (KTH). This presentation is now available.
Upcoming Papers & Presentations
Several iNEMI project teams are presenting at industry conferences this fall. Be sure to check them out if you plan to attend!
iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes — Part VII: Mechanical Shock Test and Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA Components (Lead-Free & Low Temp Soldering Technologies (LF) Track) Speaker: Jagadeesh Radhakrishnan (Intel)
Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony (Lead-Free & Low Temp Soldering Technologies (LF) Track)
Speaker: Richard Coyle, Ph.D. (Nokia Bell Labs)
IMPACT-EMAP (virtual and in-person event)
October 21-23, 2020 / Taipei, Taiwan