iNEMI Publishes Best Practices for Protecting the Reliability and Integrity of Electronic Equipment when Disinfecting for COVID-19
iNEMI recently published “Recommended Best Practices for Protecting the Reliability and Integrity of Electronic Products and Assemblies when Disinfecting for SARS-CoV-2 (COVID-19).” This document, developed by a team of experts from across iNEMI member organizations, provides guidance on how to mitigate the possible detrimental impact of disinfecting procedures on electronic equipment and assemblies. Many commonly recommended disinfection substances and/or application methods could potentially cause failures in electronic equipment. The iNEMI team reviewed key industry, government and technical sources. They also assessed the chemicals included in the U.S. EPA List N: Disinfectants for Use Against SARS-CoV-2 (COVID-19) and common application methods, identifying those substances that minimize the risk of negative impact on electronic equipment when applied in an appropriate manner.
Call for Participation
Sign Up Now for New Projects — Several new projects are currently in sign-up and have recently held call-for-participation webinars. See below for additional project details and to access webinar presentations:
Technology Integration Group (TIG) Meetings (members only) — The iNEMI TIGs play an important role in identifying key projects for collaboration. TIG participartion is open to all iNEMI member organizations and is an excellent way to help ensure that new projects focus on areas that are relevant to our members' needs. Following is a list of upcoming meetings. If you are interested in getting involved, contact the iNEMI project manager listed.
iNEMI/SMTA Technical Webinar Series — iNEMI continues its series of technical webinars with the Surface Mount Technology Association (SMTA). These webinars are focused on key topics in the industry and bring together leading experts to discuss key trends and challenges in electronics manufacturing. Presentations from the series are available, including the July webinar, “Impact of Low Temperature Soldering (LTS) on Electronic Package Dynamic Warpage Behavior & Surface Mount (SMT) Yields.”