Best Practices for Expanded Beam Connectors in Data Centers Call-for-Participation Webinar (July 7) — Join iNEMI to learn about this project’s plans to develop industry cleanliness guidelines for expanded beam connectors used in data centers. With less sensitivity to contamination and scratches, expanded beam connectors have the potential to reduce costs while maintaining high performance; however, these connectors still require inspection and cleaning to prevent performance degradation.
Sign Up Now for New Projects — Several new projects are currently in sign-up and have recently held call-for-participation webinars. Click on the links below for additional project details and to access webinar presentations:
New Package/Material Qualification Methodology Project Summary Report — This report details the project team’s recommendations to address identified gaps in current test methods and qualification standards for advanced packaging technologies. These recommendations include the need for extending the current test methods for new and future anticipated use conditions. The report also recommends tools and best practices that should be leveraged to ensure consistency across the supply chain, enabling faster assessment of new materials and, ultimately, more effective and successful qualification of new packaging technologies.
Technology Integration Groups (TIGs)
Technology Integration Group (TIG) Meetings (members only) — The iNEMI TIGs play an important role in identifying key projects for collaboration. TIG participartion is open to all iNEMI member organizations and is an excellent way to help ensure that new projects focus on areas that are relevant to our members' needs. Following is a list of upcoming meetings. If you are interested in getting involved, contact the iNEMI project manager listed.
Roadmap Article Series: "High-End Systems Product Needs — SiP, MCP and DDR5 support faster speeds and higher power requirements," Kartik Ananth, Intel, and Dale Becker, IBM; Printed Circuit Design & Fab / Circuits Assembly, June 2020, p. 29.
iNEMI / SMTA Technical Webinar Series
iNEMI/SMTA Technical Webinar Series — iNEMI is co-hosting a series of technical webinars with the Surface Mount Technology Assoication (SMTA). These webinars are focused on key topics in the industry and bring together leading experts to discuss trends and challenges in electronics manufacturing. Webinars to date have included:
Thermal Fatigue Reliability of High-Performance Pb-free Solder Alloys
Quantifying Environmental Life Cycle Impacts for ICT Products: A Simpler Approach
Low-Temperature Solder: Enabling the Future
Proposed Testing Protocols to Align Connector Reliability with Application Requirements