Advancing Manufacturing Technology

May 2020 Newsletter
Friday, May 1, 2020
Section: Monthly Newsletters

Events and Publications

May 2020

Upcoming Events

iNEMI Non-Physical Data Destruction for Enterprise Storage – Call for Participation Webinar (May 18 & 19) — Today, storage media, such as hard disk drives (HDDs) are often physically destroyed to safely eliminate all data at end of life. However, physical destruction significantly reduces the value that can be recovered from the hardware and can also incur incremental operational expense. iNEMI’s Non-Physical Data Destruction for Enterprise Storage project will investigate alternatives to physical destruction in order to increase value recovery and reduce operating expense for end-of-life storage media. This fast turn project will be open to both iNEMI members and non-members.

PCB Warpage Characterization and Minimization End-of-Project Webinar (May 13) — The use of thinner components and thinner multi-up panel PCBs (≤ 40 mils) has exacerbated PCB warpage issues in SMT assembly which, in turn, can negatively impact PCB assembly yield. iNEMI’s PCB Warpage Characterization and Minimization project studied key design and fabrication factors for thin PCBs to determine the impact on warpage. The resulting PCB warpage was analyzed using high temperature warpage measurement metrology to evaluate the ball grid arrays (BGA) and panel area PCB coplanarity. The project team will report on the analysis of the results and their recommendations.

iNEMI Council of Members (June 9; members only) — Mark your calendars for the 2020 Annual Council of Members meeting. Be sure to block the time for what we expect will be an informative and valuable session.

iNEMI Technology Integration Group (TIG) Meetings — These members-only groups enable you and your colleagues to connect with experts in your areas of interest, to anticipate the challenges facing the industry and your organization, and to help identify projects that will benefit your organization. Check for upcoming meetings and get involved!

iNEMI Roadmap Highlights Webinar Series — iNEMI is hosting a series of webinars that will cover highlights from the 2019 Roadmap. Leaders from the chapter working groups will present relevant market trends, key applications and other influences that are driving developments, along with current and future gaps that are impacting the industry. They will also review iNEMI collaborations proposed to address some of these gaps. Upcoming webinars are listed below. We will schedule additional sessions to accommodate different time zones and cover more chapters.
Wednesday, May 6 / 11:00 a.m. EDT (Americas)
Thursday, May 7 / 8:00 a.m. CST (China)
Wednesday, May 13 / 11:00 a.m. EDT (Americas)   
Friday, May 15 / 8:00 a.m. CST (China)
Wednesday, May 20 / 11:00 a.m. EDT (Americas)
Thursday, May 21 / 8:00 a.m. CST (China)
Wednesday, May 27 / 11:00 a.m. EDT (Americas)
Wednesday, June 3 / 11:00 a.m. EDT (Americas)
Wednesday, June 10 / 11:00 a.m. EDT (Americas)
Wednesday, June 17 / 11:00 a.m. EDT (Americas)

iNEMI/SMTA Technical Webinars: Low Temperature Solder: Enabling the Future (May 19) — iNEMI and the Surface Mount Technology Association (SMTA) are co-sponsoring a series of technical webinars. Check out this webinar on low temperature solder this month.


Recent Presentations & Publications

iNEMI Roadmap Webinar Presentations

  • Organic PCB — presented by Steve Payne (iNEMI) & Ed Kelley (Isola), April 22
  • Sustainable Electronics — presented by Matthew Chalkley and Tom Okrasinski, April 29

New Initiatives

Several new iNEMI project initiatives (listed below) are currently in development and additional participants are welcome. The initiative process, which defines project scope and objectives, provides the foundation for an upcoming project and is open to both members and non-members .For more information, click on the following links to download one-page descriptions of each initiative and/or contact the project managers listed below on how to get involved.