Advancing Manufacturing Technology

March 2020 Newsletter
Sunday, March 1, 2020
Section: Monthly Newsletters

Events and Publications

March 2020

Upcoming Events

Material Regulation Harmonization and Material Data Collection for Sustainable Electronics Webinar (March 4) — This webinar is an open working session to identify key areas of concern and potential projects related to material regulation harmonization and inefficiency of material data collection for sustainable electronics.

Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology End-of-Project Webinar (March 5) — This webinar will review Phase 2 results, which identified and characterized the capabilities of inspection technologies for new advanced packaging technology assembly with fine pitch substrate features. It will also discuss plans for the next phase, which will focus on fabrication and inspection of organic substrates.

Wafer/Panel Level Package Flowability and Warpage End-of-Project Webinar (April 7/8 & 16) — This webinar will review results of physical and simulation experiments conducted by the project team to better understand the flowability fundamentals of mold compounds and their impacts on quality and, potentially, warpage of the wafer or panel for subsequent processes.

iNEMI Session at SMTA Electronics in Harsh Environments (April 23; Amsterdam) — This session will focus on mid- to long-term challenges of different harsh environment applications.

iNEMI Technology Integration Groups (TIGs) Develop Technical Plans — These members-only groups enable you and your colleagues to connect with experts in your areas of interest, to anticipate the challenges facing the industry and your organization, and to help identify projects that will benefit your organization.  


Recent Presentations & Publications

iNEMI Connector Reliability Test Recommendations Project — Presented by Vince Pascucci (TE Connectivity), IPC Wisdom Wednesday Webinar, December 18, 2019.

iNEMI Presentations at IPC APEX EXPO 2020 (February 4 & 5; San Diego, California) — Download presentations from iNEMI’s PCB Technology Forum: Emerging Challenges, plus technical presentations on PCB warpage and smart manufacturing. 

REALTIME with IPC APEX Interview — iNEMI CEO Marc Benowitz talks with Joe Fjelstad about the iNEMI Roadmap, emerging technology needs and new iNEMI collaborative projects to address these needs. 

iNEMI Presentations from SMTA Pan Pacific Microelectronics Symposium (February 12; Big Island, Hawaii) — Presentations include Quantifying Environmental Life Cycle Impacts for ICT Products — A Simpler Approach, iNEMI Smart Factory Roadmap, and Comparing Past Board Assembly iNEMI Roadmaps to Technology Outcomes.

Can PCB Fabrication Processes Keep Up with Design Demands? — Article by Steve Payne (iNEMI) in the February issue of Printed Circuit Design & Manufacturing/Circuits Assembly online.

iNEMI PCB Roadmap Presentation at EIPC’s 2020 Winter Conference (February 13; Rotterdam, The Netherlands) — Steve Payne (iNEMI) introduced a roundtable discussion on roadmapping and standards development with this brief overview of the iNEMI Roadmap and highlights from the 2019 Organic PCB chapter.

iNEMI New Package/Material Qualification Methodology End-of-Project Webinar Presentation (February 19) — This webinar reviewed gaps in current test methods and qualification standards for new advanced packaging and presented recommendations for updating package qualification methodologies for new technologies and materials.

iNEMI Teams Publish Technical Plans and New Project Recommendations — Technical plans for Packaging and Sustainable Electronics — including new project recommendations — are now available to iNEMI members.