Advancing Manufacturing Technology

April 2020 Newsletter
Wednesday, April 1, 2020
Section: Monthly Newsletters

Events and Publications

April 2020

Upcoming Events

Wafer/Panel Level Package Flowability and Warpage End-of-Project Webinar (April 7/8 & 16) — This webinar will review results of physical experiments and simulation modeling conducted by the project team to better understand the flowability fundamentals of mold compounds and their impacts on quality and, potentially, warpage of the wafer or panel for subsequent processes.

PCB Warpage Characterization and Minimization End-of-Project Webinar (May 13) — Thinner components and multi-up panel PCBs has led to PCB warpage issues in SMT assembly process, which impacts PCB assembly yield. This project evaluated a 10-layer PCB test vehicle to determine warpage with various experimental factors. Warpage was evaluated using high-temperature measurement warpage metrology to evaluate the ball grid arrays (BGA) and panel area PCB coplanarity. Data analysis results and findings will be reported at the webinar.     

iNEMI Council of Members (June 8 & 9) — iNEMI Members — please hold the date for the 2020 Annual Council of Members meeting. More to come shortly but, for now, be sure to block the time for what we expect will be an informative and valuable session.

iNEMI Technology Integration Groups (TIGs) Develop Technical Plans — These members-only groups enable you and your colleagues to connect with experts in your areas of interest, to anticipate the challenges facing the industry and your organization, and to help identify projects that will benefit your organization.  

iNEMI Roadmap Highlights Series — iNEMI is launching a series of webinars that will cover highlights from the 2019 Roadmap.  Leaders from the working groups who developed the chapters will present relevant market trends, key applications and other factors that are driving developments, along with current and future gaps that are impacting the industry. The first of these webinars are listed below. Additional sessions will be scheduled to cover more topics and provide regional friendly times. Watch the iNEMI website and future emails for details and registration.


iNEMI is taking steps to address some of the key gaps identified by the roadmap, and collaborative projects being proposed and developed this year in these areas will also be reviewed.

  • Organic PCB
    Wednesday, April 22
    11:00 a.m. EDT (US) 
  • Sustainable Electronics
    Wednesday, April 29 
    11:00 a.m. EDT (US)  
  • Portable & Wireless
    Wednesday, May 6
    11:00 a.m. EDT (US)
  • Smart Manufacturing 
    Wednesday, May 13
    11:00 a.m. EDT (US)

Recent Presentations & Publications

Sustainable Electronics Roadmap Information Session — Lack of Harmonization in Materials Regulations and Inefficiencies in Data Collection (March 4, 2020).


End-of-Project/Phase 2 and Call-for-Participant/Phase 3 webinar — Wafer/Panel Level Fine Pitch Inspection/Metrology (March 5, 2020).

“Can Tomorrow’s A&D Designs Handle the Heat?” Peter M. Carter (Aeromarc LLC), based on the Aerospace & Defense chapter of the 2019 Roadmap, in the April issue of Printed Circuit Design & Fabrication/Circuits Assembly (page 68).

First Quarter 2020 Newsletter — Read about the latest accomplishments of iNEMI projects in our most recent quarterly newsletter. Highlights include details from iNEMI’s Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology project and a report on our APEX technology forum (PCB Technology Forum: Emerging Challenges). 

New Initiatives

Smart Manufacturing: Multi Directional Physical and Information Flow — Focus is on developing guidelines and best practices to facilitate efficient and effective information flow among the elements of PCB assembly in a “typical” factory environment. Contact: Kevin McGowan (

Guidelines for Materials Characterization at 5G mmWave Frequencies — Characterize ultra-low loss laminate materials using specific Df/Dk measurement methodologies in the range of 30-100GHz and provide guidelines for best practices to the industry. Contact: Urmi Ray (   

High Density Interconnect Socket Warpage Prediction and Characterization — Establish socket warpage measurement metrology and prediction methods for large, high-density socket connectors (>50x50mm), and determine the impact of molding, material properties and design on warpage. Contact: Haley Fu (

Impact of Voiding on Thermal Performance of Bottom Terminated Components (BTCs) — Determine impact of voiding on thermal performance (e.g., void density, location of voids) and develop guidelines/design rules to help reduce the impact of voiding on reliability. The initial focus will be on thermal measurement capabilities, including development of a test vehicle and thermal measurement techniques. Contact: Mark Schaffer (

Data Destruction by Non-Physical Means for Enterprise Storage — This iNEMI project will determine the feasibility of non-physical data destruction options that meet data center provider expectations in order to create a higher value stream of end-of-life storage devices that can be reused. Contact: Mark Schaffer (

Package Warpage Prediction and Characterization — This project will characterize dynamic warpage for the latest packaging technologies and establish a reliable modelling framework to optimize package warpage simulation with the objective of enabling seamless board assembly and high yield. Contact: Haley Fu (