Wafer/Panel Level Package Flowability and Warpage End-of-Project Webinar (April 7/8 & 16) — This webinar will review results of physical experiments and simulation modeling conducted by the project team to better understand the flowability fundamentals of mold compounds and their impacts on quality and, potentially, warpage of the wafer or panel for subsequent processes.
PCB Warpage Characterization and Minimization End-of-Project Webinar (May 13) — Thinner components and multi-up panel PCBs has led to PCB warpage issues in SMT assembly process, which impacts PCB assembly yield. This project evaluated a 10-layer PCB test vehicle to determine warpage with various experimental factors. Warpage was evaluated using high-temperature measurement warpage metrology to evaluate the ball grid arrays (BGA) and panel area PCB coplanarity. Data analysis results and findings will be reported at the webinar.
iNEMI Council of Members (June 8 & 9) — iNEMI Members — please hold the date for the 2020 Annual Council of Members meeting. More to come shortly but, for now, be sure to block the time for what we expect will be an informative and valuable session.
iNEMI Roadmap Highlights Series — iNEMI is launching a series of webinars that will cover highlights from the 2019 Roadmap. Leaders from the working groups who developed the chapters will present relevant market trends, key applications and other factors that are driving developments, along with current and future gaps that are impacting the industry. The first of these webinars are listed below. Additional sessions will be scheduled to cover more topics and provide regional friendly times. Watch the iNEMI website and future emails for details and registration.
iNEMI is taking steps to address some of the key gaps identified by the roadmap, and collaborative projects being proposed and developed this year in these areas will also be reviewed.
“Can Tomorrow’s A&D Designs Handle the Heat?” Peter M. Carter (Aeromarc LLC), based on the Aerospace & Defense chapter of the 2019 Roadmap, in the April issue of Printed Circuit Design & Fabrication/Circuits Assembly (page 68).
First Quarter 2020 Newsletter — Read about the latest accomplishments of iNEMI projects in our most recent quarterly newsletter. Highlights include details from iNEMI’s Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology project and a report on our APEX technology forum (PCB Technology Forum: Emerging Challenges).
Package Warpage Prediction and Characterization — This project will characterize dynamic warpage for the latest packaging technologies and establish a reliable modelling framework to optimize package warpage simulation with the objective of enabling seamless board assembly and high yield. Contact: Haley Fu (firstname.lastname@example.org).
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