iNEMI Technology Forum on PCB Challenges Scheduled at IPC APEX EXPO
If you plan to be at APEX this year (February 1-6; San Diego), join us February 5, 1:30-5:00 p.m., for iNEMI’s technology forum with panel and Q&A sessions discussing PCB challenges and needs in emerging applications. A broad range of demanding applications will be discussed, along with insights on the underlying PCB enabling capabilities needed, such as materials fabrication and assembly. OEMS, materials suppliers and other stakeholders will share their perspectives on the developments needed to ensure high-volume capabilities for the applications of the next decade.
Smart Manufacturing Roadmap. In addition to the iNEMI technology forum, Daniel Gamota (Jabil Circuit) and Ranjan Chatterjee (Cimetrix) will present information from the Smart Manufacturing chapter of the 2019 iNEMI Roadmap as part of the APEX technical conference. Their presentation is included in Session 10: Industry 4.0 (Wednesday, February 5 / 10:30 a.m. — 12:00 p.m. / location: 30DE).
iNEMI Presentations at SMTA Pan Pacific Microelectronics Symposium (February 10-13; Big Island, Hawaii) — If you plan to attend this year’s Pan Pac conference, be sure to check out iNEMI’s presentations on Wednesday, February 12. In the morning, Marc Benowitz (iNEMI) is presenting, “Quantifying Environmental Life Cycle Impacts for ICT Products — A Simpler Approach” as part of the Reliability session. Later in the day, Marc is chairing a roadmap session that includes Ranjan Chatterlee’s (Cimetrix) presentation, “iNEMI Smart Factory Roadmap,” and a presentation from Annaka Balch (Dartmouth College) and Ron Lasky (Indium Corporation and Dartmouth College), “Comparing Past Board Assembly iNEMI Roadmaps to Technology Outcomes.”
iNEMI PCB Presentation at EIPC’s 2020 Winter Conference (February 13 & 14; Rotterdam, The Netherlands) — Steve Payne (iNEMI) will present highlights from the PCB chapter of the 2019 iNEMI Roadmap as part of a roundtable discussion on roadmapping and standards development scheduled for Thursday, February 13, 13:40-14:40.
New Packaging Technology Qualification Methodology End-of-Project Webinar (February 19, 2020) — The project team will discuss the gaps identified in current test methods and qualification standards for new advanced packaging. The team’s study of present qualification methodologies and best practices, in conjunction with an assessment of new applications and use conditions requirements, has resulted in recommendations for package qualification methodologies for new technologies and materials, which will be presented. Click here for more information about the project.
iNEMI Technology Integration Groups (TIGs) Develop Technical Plans — iNEMI’s Technology Integration Groups (TIGs) meet regularly to identify, prioritize and define iNEMI projects in their respective technology areas. These members-only groups enable you and your colleagues to connect with experts in your areas of interest, to anticipate the challenges facing the industry and your organization, and to help identify projects that will benefit your organization. Members — get involved in establishing the iNEMI technology agenda for 2020. You are welcome to join any of the TIGs by contacting the iNEMI project managers listed below.
Packaging: Masahiro Tsuriya (email@example.com) Next meeting: January 22
Review recommendations: February 12
PCB & Laminate: Steve Payne (firstname.lastname@example.org) Next meeting: January 14 (Asia) & 21 (The Americas/Europe)
Smart Manufacturing: Mark Schaffer (email@example.com) Next meeting: to be scheduled
Sustainable Electronics: Mark Schaffer (firstname.lastname@example.org) Next meeting: January 22 Review recommendations: February 19
5G Materials Assessment and Characterization— An iNEMI working group is currently meeting to identify industry needs and potential collaborative projects in 5G materials assessment and characterization. Areas identified for possible investigation include best practices for high-frequency materials testing, standard test coupon development, simulation vs. measurement correlation, understanding fundamental process variables (e.g., during PCB/substrate fabrication), test set-up and more. If you are interested in getting involved in defining the focus for this new initiative, please contact Urmi Ray (email@example.com).
Recent Presentations & Publications
Three Additional Roadmap Chapters are Available— The Ceramic Interconnect & Photovoltaics, Connectors, and Passive Components chapters of the 2019 Roadmap are now available online. The Ceramics chapter provides an update on several key ceramic interconnect technologies, such as thick film, high and low-temperature co-fired, thin film, pure copper metallization on ceramic, and lead-free thick film. It also covers crystalline silicon solar cell design, fabrication and testing. The Connectors chapter provides comprehensive information about electronic connectors, updating the business, component, and substrate trends, and the impact of these trends on the manufacturing processes for surface mount, part placement, wave and selective soldering, press-fit and rework/repair. The Passive Components chapter discusses technology needs and recommendations for capacitors, resistors, magnetics and circuit protection components, and outlines the specific needs for passive components for key markets such as automotive, medical and high-end systems.
EPTC Panel Session: Packaging Challenges & Opportunities for 5G Applications (December 4, 2019; Singapore) — iNEMI co-organized this session at the 21st Electronics Packaging Technology Conference (EPTC). A diverse panel, including Samsung Electronics, Hitachi Chemical, Fujitsu and TTM, outlined the key drivers and applications for 5G such as high-speed computing, smart phones, automotive, networking, IoT etc. The panel-led interactive session discussed many of the design and material challenges that 5G presents, including antenna-in-package (AiP) and beam-forming antenna module array with package-level integration, substrates and PCB fabrication requirements, material characterization, and measurement and test challenges. This session has contributed to the development of an ongoing iNEMI initiative on 5G mmWave material characterization and testing. Several of the presentations from the panelists at this session are available online.
1st Level Interconnect Void Characterization Project— This new iNEMI project held call-for-participation (CFP) webinars on December 12. The project will characterize micro voiding in flip chip packages. It will also seek to understand how voiding at the 1st level interconnect affects product reliability and what level of voiding is acceptable to achieve the necessary reliability requirements. Interested in participating? Get additional project details.
Fourth Quarter 2019 Newsletter — Read about the latest accomplishments of iNEMI projects in our most recent quarterly newsletter. Highlights include details from the iNEMI Warpage Characterization and PCBA Cleanliness projects along with information about three new projects.
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