iNEMI Forum at IPC APEX EXPO 2020 (February 5; San Diego, CA) - If you're at APEX this year, be sure to join us for our panel and Q&A sessions discussing PCB challenges and needs in emerging applications. In addition, presentation from the Smart Manufacturing Roadmap and Warpage Characterization and Minimization project are featured in the technical conference.
New Packaging Technology Qualification Methodology End-of-Project Webinar (February 19) — The project team will discuss the gaps identified in current test methods and qualification standards for new advanced packaging, present recommendations for package qualification methodologies for new technologies and materials, and discuss next steps. Click here for more information on the project.
iNEMI Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project 2 End-of-Project Webinar (March 5) - Inspection limitations impact yield assessment and quality validation on substrates used for integrated SiP packages. With the objective of characterizing and determining the capabilities of existing inspection and measurement techniques and how ready they are for the increasing challenges of advanced packaging technologies, the project team will report on the evaluation of initial silicon and glass test vehicles with lines and spaces (< 10mm) and a testing defect pattern including linewidth and spacing violations, shorts or open circuits, cuts holes etc. Phase 3 of this project, which is planned to start in Q2, which will focus on evaluating the fabrication and inspection of organic versions of test vehicle will also be discussed. Click here for more information on the project.
iNEMI Technical Session at ICEP (April 23; Tokyo) - The iNEMI session features presentations on Industry 4.0, packagaing technologies for heterogeneous integration, package warpage management, and panel-level packaging flowability and warpage.