Advancing Manufacturing Technology

February 2020 Newsletter
Saturday, February 1, 2020
Section: Monthly Newsletters

Events and Publications

February 2020

Upcoming Events

iNEMI Forum at IPC APEX EXPO 2020 (February 5; San Diego, CA) - If you're at APEX this year, be sure to join us for our panel and Q&A sessions discussing PCB challenges and needs in emerging applications. In addition, presentation from the Smart Manufacturing Roadmap and Warpage Characterization and Minimization project are featured in the technical conference. 

iNEMI Presentations at SMTA Pan Pacific Microelectronics Symposium (February 12; Big Island, Hawaii) — if you plan to attend this year's Pan Pac Conference, be sure to check out our presentations on quantifying environmental life cycle impact and roadmapping. 

Webinar: Packaging Technical Plan (members only; February 12) - The Packaging Technology Integration Group (TIG) will review recommendations for potential iNEMI projects. Two session are scheduled. 

iNEMI PCB Presentation at EIPC’s 2020 Winter Conference (February 13; Rotterdam, The Netherlands) 

New Packaging Technology Qualification Methodology End-of-Project Webinar (February 19) — The project team will discuss the gaps identified in current test methods and qualification standards for new advanced packaging, present recommendations for package qualification methodologies for new technologies and materials, and discuss next steps. Click here for more information on the project.

Webinar: Sustainable Electronics Technical Plan (members only; February 19 & 20) - The Sustainable Electronics Technology Integration Group (TIG) will review recommendations for potential iNEMI projects. Two sessions are scheduled. 

iNEMI Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project 2 End-of-Project Webinar (March 5) - Inspection limitations impact yield assessment and quality validation on substrates used for integrated SiP packages. With the objective of characterizing and determining the capabilities of existing inspection and measurement techniques and how ready they are for the increasing challenges of advanced packaging technologies, the project team will report on the evaluation of initial silicon and glass test vehicles with lines and spaces  (< 10mm)  and a testing defect pattern including linewidth and spacing violations, shorts or open circuits, cuts holes etc. Phase 3 of this project, which is planned to start in Q2, which will focus on evaluating the fabrication and inspection of organic versions of test vehicle will also be discussed. Click here for more information on the project.

iNEMI PLP Flowability & Warpage EoP Webinar (April 8 & 16) - Wafer Level Packaging (WLP) and the movement to Panel Level Packaging (PLP) have received industry attention as more cost-effective processes.

iNEMI Technical Session at ICEP (April 23; Tokyo) - The iNEMI session features presentations on Industry 4.0, packagaing technologies for heterogeneous integration, package warpage management, and panel-level packaging flowability and warpage. 

iNEMI Session at SMTA Electronics in Harsh Environments (April 23; Amsterdam, Netherlands) - More information to come on our session at SMTA Electronics in Harsh Environments

iNEMI Technology Integration Groups (TIGs) Develop Technical Plans — These members-only groups enable you and your colleagues to connect with experts in your areas of interest, to anticipate the challenges facing the industry and your organization, and to help identify projects that will benefit your organization.  


Recent Presentations & Publications

Additional 2019 iNEMI Roadmap Chapters Published — The Flexible Hybrid Electronics and Portable & Wireless chapters, along with an updated version of the Organic PCB chapter, are now available.