METech Recycling. The first representative is Nicholas Jackson; and the alternate representative is Robert Laughlin. METech is an industry leader in recycling electronic scrap, providing electronics recycling and asset recovery services for more than 40 years. With facilities in California, Colorado, Massachusetts, North Carolina and Utah, as well as in Europe and Asia, the company allows for reuse, refurbishment and efficient extraction of precious metals and recyclable materials from electronic scrap while complying with global standards. Services include: IT asset management and disposition, certified data destruction, electronics recycling, and reverse logistics and redeployment.
Pegatron Corporation. The first representative is Kelly Chao; and the alternate representative is Perry Kuo. Pegatron has combined EMS and ODM industries to become a design and manufacturing services (DMS) company. Founded in 2008, the company is headquartered in Taipei City, Taiwan. With extensive product development experience and vertically integrated manufacturing, Pegatron provides innovative design, systematic production and manufacturing services. Their product portfolio covers a wide range of technology products including primarily computing devices, consumer electronics and communication devices.
Shenmao Technology Inc. The first representative is Watson Tseng; and the alternate representative is Keith Lee. Headquartered in Taoyuan City, Taiwan, Shenmao Technology Inc. is a professional solder materials manufacturer providing solder paste, solder bar and cored solder bar. With more than 40 years of experience, Shenmao provides superior PV ribbon, tin-lead solder paste, bumping solder paste and flux for semiconductor packaging use.
VALUE RECOVERY REPORT PUBLISHED
The Value Recovery from Used Electronics Project has published an extensive report that details a process and methodology that promises to substantially improve the economic and resource value recovered through electronics reuse and recycling. Hard disk drives (HDDs) are used as the case example. Based on the concepts of a “circular economy,” the process outlined is built on decision pathways for HDD refurbishment, component reuse and material recovery and incorporates economic and resource recovery analyses. The findings are intended to remove existing barriers and establish the basis for an implementable system. Further project activity will use a collaborative, stakeholder-based approach for building a voluntary, self-governing system. The methodology could also be used as a model to address other electronic components and products. The goal is a sustainable circular economy of HDDs, and eventually all electronics, based on efficient and full exploitation of value potentials inherent in the products. Download a copy of the report.
Don’t forget to sign up for the second quarter member update webinar. We’ll provide a status update on the roadmap as well as deployment projects. We’ll also review information from the recently published 2016 Integrated Photonic Systems Roadmap (IPSR) and have project reports from the joint iNEMI-IPSR project on board-level optical interconnect and on projects based in Asia. Check the website for agenda and times
This project, which is currently in sign-up, proposes to design, assemble and test a prototype on-board fiber optic interconnection system based on silicon photonic transceiver modules, single-mode fiber cables, and expanded-beam optical connectors for the package, backplane, and front-plane interfaces. Existing technologies will be leveraged wherever possible. This project will comprise Phase 1; the second phase will investigate the use of PCB-embedded waveguides to replace fly-over fiber cables.
Approaches to Minimize PCB Warpage in Board Assembly Process to Improve SMT Yield
Increasingly thinner boards are driving higher PCB warpage in the board assembly process, leading to lower assembly yields and higher rework for some components. This initiative will identify factors that influence PCB warpage and recommend solutions to mitigate warpage in the SMT assembly process. We encourage participation from OEMs, EMS providers, PCB shops, SMT equipment and tooling suppliers, and warpage measurement as well as simulation service providers. For additional information.
Most of the 2017 Roadmap chapters are now available online for members, including Aerospace & Defense, Automotive, Medical, Interconnect Substrates—Ceramic and Packaging & Components Substrates. The Information Management chapter will be available soon, along with the Executive Summary and full roadmap file. The roadmap will go on sale to non-members later this month. Be sure to check out these latest additions. If you have any problems accessing the roadmap, please contact Dee-Dee Taylor.
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