Advancing Manufacturing Technology

January 2022 Monthly Newsletter
Section: Monthly Newsletters

In This Issue
January 2022
Upcoming Events

Electromigration of SnBi Solder for Second-Level Interconnect Call for Participation (January 11 & 13) — Although the low melting temperature of SnBi alloys makes them attractive for assembling thermally warpage-prone high-density microelectronic packages, Bi has a high propensity for electromigration, which can lead to potentially brittle solder joints with high electrical resistance over time in the field. This iNEMI project plans to investigate the potential to reduce electromigration in low height solder joints by taking advantage of mechanical and/or chemical back stresses. Join our call-for-participation webinar to learn more.  

Moisture Induced Expansion Metrology for Packaging Polymetric Materials Call for Participation (January 17 & 18) — The polymeric materials in electronic packaging can absorb moisture from the environment, causing material swelling and inducing hygro-stress, which can lead to component warpage, delamination or popcorn failure. Knowledge of the moisture properties of polymeric materials is critical for optimizing package material and design to minimize moisture-related failures. However, these properties are not widely available due to a lack of measurement methods and the limited temperature capability of current commercial techniques (20-120°C). The value delivered by this new project is an experiment-based assessment of metrology options for characterization of materials expansion measurement plus identification of methods that extend swelling strain measurement capabilities beyond current temperature limits. 

Panel Level Package Fine Pitch Substrate Inspection/Metrology Project Call for Participation (January 20 & 21) — Join us in one of two information sessions to learn more about this new project. Heterogeneous SiP packages, which are increasingly used as electronic packaging solutions, require finer circuitry patterns designed within the substrate/interposer (lines and spaces <10um). The fine pitch substrates/interposers plus larger panel sizes and more layers on substrates demand increased AOI capability. This new iNEMI project will study defect detection plus line width and space measurement for circuit patterns below 5um. It will provide a better understanding of current AOI measurement and inspection systems and the latest technology trends for AOI solutions with the ultimate goal of driving innovative AOI inspection systems to reduce the defect escape risk for finer pattern substrate and interposers. 

iNEMI Presentation at EMA (January 21) — Urmi Ray (iNEMI) will present "Innovative Approaches to Solve Low Loss Materials Characterization Challenges" at the Hybrid Electronic Materials and Applications 2022 (EMA 2022) conference, hosted by the American Ceramics Society. This invited presentation is part of Session 12: 5G Materials and Applications Telecommunications: Metrology and Characterization of Materials. Be sure to check out this session if you plan to participate in EMA this year. 

iNEMI at APEX (January 26; San Diego, California) — We have several activities going on at APEX this year. Be sure to stop by if you plan to be there.

  • “Refreshing the iNEMI Technology Roadmap for Electronics Manufacturing,” Shekhar Chandrashekhar (iNEMI)
  • Poster session presentation: "Great things happening in sustainable electronics: a report from the iNEMI Sustainable Electronics Technology Integration Group," presented by Kelly Scanlon (IPC) on behalf of Mark Schaffer (iNEMI)
  • "Eco-Design for a Circular Economy — Best Practices in the Electronics Industry," Session 24/CE1 Sustainability, presented by Kelly Scanlon (IPC) on behalf of Karsten Schischke (Fraunhofer IZM)
Presentations Available

Back End Commonality for Advanced Packaging: Large Form Factor End-of-Project Webinar Presentation (members only) — This iNEMI project team focused on increasing effectiveness and productivity in back-end manufacturing by defining and demonstrating best practices for next-generation media/carrier designs. The webinar reported project results, including a description of the design approach used and the guidelines developed as part of this project.

iNEMI Tech Topic Series: Eco-Design for Circular Electronics Economy #6 — Jan Daem, Environmental Compliance Officer for Barco, talked about how the company is embedding eco-design and circular economy concepts into their product design, including development of their own Barco Ecoscore Tool. The company scores their products, covering four major life cycle domains: energy efficiency, material use, packaging and end of life.


Advanced Packaging Tech Topic Series: Microprocessor Power Delivery — Challenges & Solutions (members only) — The November Packaging webinar featured Intel Fellow Kaladhar Radhakrishnan talking about the importance of delivering a clean power supply to microprocessors to optimize their performance, and how doing so has become more challenging with the growth in power levels and the number of power rails in high-performance microprocessors. 

iNEMI Session at IMPACT 2021 — iNEMI moderated a session featuring presentations by our members on iNEMI projects relevant to 5G+. These projects are all focused on enabling the faster and more effective deployment of 5G materials and technologies. In addition, iNEMI Board member Paul Hale (NIST) delivered the keynote address. 


iNEMI Presentation at EPTC (members only) — “Organic Panel Fine Circuit Pattern Inspection and Metrology for Readiness,” Feng Xue (IBM Singapore). This presentation from iNEMI’S Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology project focused on the analysis of existing inspection capabilities for very fine pitch organic substrates.

End-of-Project Presentation: Package Warpage Prediction and Characterization — iNEMI has conducted several projects researching the dynamic warpage characteristics of the latest packaging technologies. The recently completed Phase 5 of the project addressed warpage prediction. The project team conducted experiments on organic packages, characterized material properties, including those of substrate raw materials, and looked into the impact of curing processes on package warpage.

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