Advancing Manufacturing Technology

August 2017 Newsletter
Tuesday, August 1, 2017
Section: Monthly Newsletters

August 2017
For iNEMI Members Only
iNEMI is offering a discount to member companies who pay their membership fees in advance.  Pay your 2018 dues by October 31 and save; pay for both 2018 and 2019 and save even more. Download additional details about the membership discounts. Please contact Linda Anderson-Jessup, iNEMI Membership Manager, if you would like to take advantage of this offer.

The Q3 iNEMI Members Update webinar is scheduled for August 29. There will be two sessions: 9:00-10:00 a.m. China Time and 10:00-11:00 a.m. Eastern Time (US) / 4:00-5:00 p.m. CEST (Central Europe). The hour-long webinars will focus primarily on packaging issues with presentations from the 2017 Packaging & Component Substrates TIG on identified gaps and needs along with proposed projects, plus a presentation entitled “eWLB FOWLP: Good to Great,” by Dr. Seung Wook Yoon (STATS ChipPAC). This is a members-only meeting, and advance registration is required. Details and registration


The PCB/PCBA Material Characterization for Automotive Harsh Environments Project has published a project report that is available to iNEMI members. This project focused on identifying and defining a set of reliability qualification methods for critical electronic PCB assemblies used in harsh environments such as “under-the-hood” automotive applications. The project report is available online (requires log-in since it’s a members-only report), and an end-of-project (EOP) webinar is scheduled for September 7. The EOP webinar is open to non-members as well as members. Details and registration.

Check Us Out at SMTAI (Chicago, Illinois)
iNEMI’s Bill Bader (CEO) and Grace O’Malley (Executive Vice President) will be attending SMTAI in Chicago this September. If any iNEMI members want to meet on Monday, September 18, or Wednesday, September 20, please contact Grace O’Malley to schedule a time and place. Also, be sure to check out iNEMI presentations while you’re there.

See You at IMPACT 2017 (Taipei)
Work from several iNEMI projects will be showcased in an iNEMI session scheduled for October 27 (10:30 a.m. to noon) as part of the International Microsystems, Packaging, Assembly and Circuits Technology conference (October 25-27; Taipei Nangang Exhibition Center). Topics will include packaging, PCBs, and board assembly. IMPACT is organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA. This year’s theme is “IMPACT on Intelligent Everything.” We hope to see you there! 
IPSR Webinar SeriesIntegrated Photonic Sensors Manufacturing - August 10
IPSR Webinar SeriesAssembly Processes – August 24
Q3 iNEMI Member Update Webinar – August 28 & 29
iNEMI Roadmap WebinarPackaging & Component Substrates - August 30
Call-for-ParticipationValue Recovery from Used Electronics, Phase 2 – September 6 & 7
iNEMI Roadmap WebinarBoard Assembly - September 13
iNEMI at SMTAI (Rosemont, Illinois, USA) – September 17-21
iNEMI Session at 2017 IMPACT (Taipei, Taiwan) – October 27
FUTURECAR copy.png


Packaging Innovation Maintains the Pace of Progress as Moore's Law Scaling Slows, W.R. (Bill) Bottoms

We'll Be Asking for Feedback
Keep an eye out for a short follow-up survey after upcoming events and at the completion of projects. We would appreciate you filling them out — your feedback is very important to us and will help us refine our activities to meet your needs.
New Project: Value Recovery from Used Electronics, Phase 2
Call for Participation: September 6 & 7

This fast-turn project will focus on collaboration in hard disk drive design, reuse, remanufacturing, and materials and component recovery that enables a robust, sustainable circular supply economy for hard disk drives. Project leaders William Olson (Seagate) and Carol Handwerker (Purdue University) will present the scope of work and other information about this project. Details and registration.

New Projects in Sign-Up

New Packaging Technology Qualification Methodology
Sign up by August 15

This project plans to develop a methodology to address the gaps in current standards and standard practices for package qualification. See the website for presentations from the call-for-participation webinars on July 10 & 11.

Warpage Characteristics of Organic Packages, Phase 4
Sign up by August 18

The goal of this project is to understand the kind of dynamic warpage demonstrated in industry. The project has accomplished three phases addressing metrology challenges and the recent trends of package warpage characteristics. The presentation and recording from the call-for-participation webinar held on July 28 can be found on the website.

Chapter-Focused Webinars Planned
Packaging and Board Assembly Scheduled

We’ve scheduled two webinars, each focusing on a specific chapter of the 2017 Roadmap, which allows us a more in-depth discussion of the topics. Both sessions will be recorded, so if you are unable to attend at these times, you can listen to the webinar later. (Click on headings below for details and registration.)

Packaging & Component Substrates
August 30, 1:00-2:00 p.m. EDT
Presenter: Bill Bottoms (3MTS), Chair, Packaging & Component Substrates TWG

Board Assembly
September 13, 1:00-2:00 p.m. EDT
Presenter: Paul Wang (MiTAC International Inc.), Chair, Board Assembly TWG

iNEMI Technical Plan Progresses
All seven Technology Integration Groups (TIGs) are developing their technology plans for 2017. These plans propose projects that address gaps identified as critical in the 2017 iNEMI Roadmap, fit within the iNEMI scope of interest and have member support on the TIGs. We are looking for iNEMI members to help edit drafts of all seven documents. If someone in your company would like to help in the development of the 2017 iNEMI Technical Plan, please contact Chuck Richardson. The Technical Plan is a key element in project planning for the next two to five years, so please support this important effort.
Research Priorities Development Meeting Held in July
Members of the 2017 iNEMI Research Committee met July 25-27 to work on the 2017 Research Priorities. This document takes the strategic needs from the latest roadmap, as vetted by the iNEMI Technical Committee, and refined by iNEMI’s TIGs. The Research Committee uses these inputs to prepare the biennial Research Priorities. The resulting prioritized and categorized needs are then made available to the supply chain to focus research resources for suitable resolution of needs and/or gaps.
iNEMI   2214 Rock Hill Road  Suite 110  Herndon  VA   20170-4214   USA