|
|
| |
iNEMI Workshop on Reliability Challenges & Solutions for Automotive Electronics
Join iNEMI in Shanghai October 30 for a workshop on the reliability requirements and challenges posed by the ever-increasing electronics found in today’s automobiles. Hosted by iNEMI member ZESTRON, this workshop will provide an interactive forum where participants can discuss and share knowledge and experiences on topics such as:
- Material and technology trends for automotive electronics
- Current reliability issues of the electronics in EVs, including PCBs, solder joints, components and subsystems
- Material characterization, failure analysis, reliability modeling, standards and specifications
- Knowledge gaps and collaboration opportunities to address common issues facing the automotive supply chain to speed up material and technology development and to mitigate reliability risks and improve yield and quality
The agenda presently includes speakers from NIO, SAIC-VW, Continental, ESI Automotive (MacDermid Alpha), IMI, Infineon, UAES, and Binjiang Insititute of Zhejiang University. For additional details and registration.
| |
|
|
5G/6G mmWave Materials & Electrical Test Technology Roadmap Workshop: Gaps and Challenges
Under a grant from NIST’s Advanced Manufacturing Technology Roadmap Program (MFGTech), iNEMI is developing the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO). The objective of this program is to develop in the U.S. a world-leading knowledge base, technical expertise and a roadmap for development of mmWave material selection, characterization and test capabilities. One of the crucial inputs for the roadmap is a comprehensive summary of key issues facing the industry. This iNEMI workshop, scheduled for September 8, will share preliminary results gathered from a survey/questionnaire focused on identifying gaps and challenges in this area. In addition, we will welcome audience feedback in this interactive session. Speakers are Urmi Ray (iNEMI) and E. Jan Vardaman (TechSearch International). For additional information, please contact Urmi Ray (urmi.ray@inemi.org).
|
|
|
|
|
| |
|
Two iNEMI Papers Recognized by ICEP 2022
Two iNEMI project teams have received Outstanding Technical Paper awards for papers presented at the International Conference on Electronics Packaging (ICEP), held in Hokkaido, Japan, May 11-14. iNEMI’s Moisture Induced Expansion Metrology for Packaging Polymetric Materials project was recognized for their paper, “Novel Method for Measuring High Temperature Hygroscopic Swelling.” Congratulations to presenter Ian Chin (Intel Microelectronics) and co-authors Wei Keat Loh (Intel Microelectronics) and Mohd Zulkifly Bin Abdullah (Universiti Sains Malaysia).
The 1st Level Interconnect Void Characterization project was also recognized for “Voids in First-Level Interconnects and Their Impact on Solder Joint Reliability,” discussing the preparation and reliability testing of assemblies with voids. The paper was presented by Kor Oon Lee (Intel Corporation). Co-authors are: Kiyoshi Oi (Shinko Electric Industries Co. Ltd), Sze Pei Lim (Indium Corporation), Yvonne Yeo (IBM Corporation), Keith Sweatman (Nihon Superior Co. Ltd), Toshiaki Ono (Nordson Test & Inspection), Kei Murayama (Shinko Electric Industries Co. Ltd), Steven R. Martell (Nordson Test & Inspection), Haruo Shimamoto (AIST) and Masahiro Tsuriya (iNEMI). Congratulations to the authors and both project teams.
Download these and other iNEMI papers presented at ICEP 2022.
|
|
White Paper Published on Low Temperature Materials
iNEMI’s Low Temperature Materials for Packaging First Level Interconnect project has published a white paper that reports the project team’s investigation into the extent to which the use of lower temperature processes can provide solutions to the challenges of heterogenous integration. Elements of these types of packages have limits on temperature/time exposure, which makes materials that can affect reliable connections at temperatures lower than those required by conventional lead-free systems such as SnAgCu (SAC) solder worth consideration.
A task force from the project reviewed material and process options currently available or under development on the basis of their compatibility with the interfaces that have to be connected and the operating conditions to which they are likely to be exposed in integrated circuit packages. Their investigation included a literature survey to determine the current status of low temperature materials (LTMs) within industry and a market survey to determine interest in lowering process temperatures in 1st level assembly, the extent of current usage of LTM, and the need and driving factors for LTM in 1st level interconnections. The white paper reports the team’s findings about the prospects for adoption of LTMs for 1st level interconnect. Download the white paper (currently available to iNEMI members only; log-in required). For additional information, please contact Masahiro Tsuriya (m.tsuriya@inemi.org).
|
|
Next Wave of iNEMI Roadmap Projects: Call for Contributors
The last four months of 2022 will be an exciting, but busy, time for the new iNEMI Roadmap. We are building contributor teams for the following topics:
• Board Assembly
• PCB
• Advanced Packaging and Heterogenous Integration
• Sustainable Electronics
• Supply Chain Resiliency
If you wish to contribute to the new iNEMI Roadmap on these or any other topics, please fill out the expression-of-interest form. This is an excellent opportunity to work with other experts to shape the technology agenda for the electronics manufacturing ecosystem.
If you'll be attending ASME’s InterPACK conference in October, be sure to join iNEMI at our roadmap workshop session (see item below).
|
|
|
|
|
|
|
|
Call-for-Participation Webinar: PCB Characterization for CAF and ECM Failure Mitigation Project (September 7 & 8) — CAF (conductive anodic filament) failures are an electrochemical migration (ECM) process that causes short circuits in PCBs. iNEMI’s PCB Characterization for CAF and ECM Failure Mitigation project will assess several areas of concern related to CAF failure, including scaling and integration of laser and mechanical drill features, incoming quality measures of glass/resin systems, and manufacturing process factors that may limit future targets and demands. The team will develop a better understanding of CAF through hardware failure analysis along with characterization and study of material and process factors driving CAF. Join us for this information session to learn more about the project. For additional information, contact Steve Payne (steve.payne@inemi.org).
|
|
iNEMI Smart Manufacturing Series: Visual Data Enables Surgical Traceability by the Power of AI and Big Data (September 8) — Component shortages and increasing demands on the supply chain have led to a heightened risk of not only counterfeit parts but also problems with components that are out of date, in mixed lots, badly handled, tampered with or defective. The third webinar in the iNEMI Smart Manufacturing Tech Topic series (rescheduled from July 14) will feature Eyal Weiss, founder and CTO of Cybord, talking about the company’s patented deep visual inspection technology and how it can help improve electronic product reliability and material sourcing with inline AI component inspection software. For additional information, contact Mark Schaffer (marks@inemi.org).
|
|
End-of-Project Webinar, Session 2: Module with Separable Single-Mode Expanded-Beam Optical Interface for Edge-Coupled PIC Optics Project (September 29) — Expanded-beam fiber-optic connectors have been developed for fiber-to-fiber connections where they can provide relaxed alignment tolerances and reduce effects of contamination. These connectors are commercially available for multi-mode fiber but are still in development for single-mode fiber. iNEMI’s Module with Separable Single-Mode Expanded-Beam Optical Interface for Edge-Coupled PIC Optics project developed designs and processes for providing a single-mode expanded-beam connector interface on a module housing a photonic integrated circuit (PIC). In this end-of-project webinar, the project team will report performance data for the PIC modules they built and characterized. Watch the iNEMI calendar for scheduling details, and for additional information, contact Grace O’Malley (gomalley@inemi.org).
|
iNEMI Roadmap Workshop at InterPACK (October 25-27; Garden Grove, California) — iNEMI Director of Roadmapping Francis Mullany will host an iNEMI Roadmap workshop session at ASME’s International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK). The focus of the workshop will be on market and technology drivers for advanced packaging. Watch the iNEMI calendar for details.
|
|
|
iNEMI Presentation at IMPACT 2022 (October 26-28; Taipei, Taiwan) — iNEMI’s 1st Level Interconnect Void Characterization project will present “The Effects of Voids on Solder Joint Reliability in First Level Interconnect” at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference. iNEMI is a co-organizer of this event which will be held at the Taipei Nangang Exhibition Center, Taipei, Taiwan. Watch the iNEMI calendar for additional details.
|
MAPT Roadmap Seeks Input from iNEMI Members with U.S. Interests — The Microelectronic and Advanced Packaging Technology (MAPT) consortium, funded in part by NIST and managed by the Semiconductor Research Corporation (SRC), aims to create an open roadmap for microelectronics manufacturing and advanced packaging technology. The roadmap seeks to inform future US-focused R&D initiatives in these domains. iNEMI is a partner and MAPT is looking for input from our members with U.S. interests. Download this members-only file for additional information about how you can contribute and, if interested, please contact Professor Carol Handwerker (Purdue University; carolh@purdue.edu).
|
|
|
iNEMI Presentations at SMTA International (October 31-November 3; Minneapolis, Minnesota) — Three iNEMI project teams will be presenting at the SMTAI conference this year (see below). Watch the iNEMI calendar for additional details re: sessions and times.
|
|
|
|
|
|
| Presentations & Papers Available |
|
- iNEMI’s Packaging TIG Kick-Off/Information Meeting (August 24/25; members only)
- iNEMI papers receiving the Outstanding Technical Paper Award from ICEP 2022:
- iNEMI Project Portfolio — Get a quick overview of iNEMI’s active projects and a look at what’s in the pipeline for future development.
|
|
|
|
September 2022