Advancing Manufacturing Technology

December 2017 Newsletter
Friday, December 1, 2017
Section: Monthly Newsletters

December 2017
For iNEMI Members Only
Dear Members,

This past year has been another very productive one for iNEMI. One of the key highlights was the publication of the 2017 Roadmap — our largest and most extensive to date. With 28 chapters and more than 2,300 pages, the roadmap featured a new PEG chapter on IoT (Internet of Things), plus once again included chapters on Aerospace & Defense, Packaging & Component Substrates, and Test, Inspection & Measurement.

This roadmap was the last under Chuck Richardson’s leadership. We thank Chuck for his dedication in helping the roadmap grow and evolve over the past 11 years, and are pleased that he will continue working with us on a part-time basis as a consultant managing special projects and helping support roadmap activities. Linda Wilson has already jumped into her new role as manager of the roadmap and has begun work on the 2019 edition.

The seven Technology Integration Groups (TIGs) used the roadmap to do a thorough gap analysis, identify areas on which iNEMI should focus our efforts, and recommend specific collaborative projects. The results of this effort were published in the 2017 iNEMI Technical Plan, available to all members. As the end of the year approaches, we are wrapping up the Research Priorities (also based on roadmap findings), a public document that is shared with universities, research institutes and funding agencies to help prioritize industry research needs.

iNEMI deployment projects were active this year, with six projects completed and five new projects launched. Altogether, we had more than 300 individuals engaged in iNEMI projects throughout the year.

Many of the project teams and roadmap leaders reported on their work at industry conferences and workshops around the world, including the U.S., Singapore, Japan, Malaysia, Germany, France and the U.K.

Last, but certainly not least, we welcomed nine new members to the iNEMI roster: Critical Materials Institute (CMI), HP Inc., METech Recycyling, Pegatron Corporation, Rochester Institute of Technology (RIT), Shenmao Technology Inc., SVXR Inc. (Silicon Valley Xray), Tin Products Manufacturing Ltd, and Urban Mining.

As we end the year we are sad to say that Bill Bader will be retiring as our CEO on January 1, 2018. Bill has worked to ensure a smooth transition to the new CEO, who will be announced and will come on board in January.

As always — thank you for your support of iNEMI. It is our members who make it all work. Enjoy your holidays and may the new year be a prosperous one for you!

The iNEMI Staff
HP Inc. Joins iNEMI

iNEMI is pleased to welcome HP Inc. to our membership roster. The first representative is Henry Lewis; and the alternate representative is Kris Troxel

HP Inc. “creates technology that makes life better for everyone, everywhere,” offering a portfolio of printers, PCs, mobile devices, solutions and services.

Meetings in Europe

Thursday, December 21, 11:00 a.m. EST

iNEMI members are invited to participate in this webinar by the Integrated Photonic Systems Roadmap (IPSR). Part of the AIM Photonics Academy Roadmap Webinar Series, this webinar will discuss the grand challenges and key needs for commercially viable, high-volume manufacturing of photonic-enabled functionality. 

The drive to continue the performance scaling of commercial electronic systems at the current pace of 1000x/10yr has created a strong demand for converged electronic-photonic systems. This convergence transition consists of four grand challenges: integration, standardization, cross-market platforms and supply chain coordination.

Join Dr. Lionel C. Kimerling, MIT Microphotonics Center, as he discusses these challenges and the key needs to be fulfilled in 2018 to meet them.

Additional information & registration.

IPSR Webinar: Grand Challenges and Key Needs for 2018 – December 21
Member meeting in Japan — January 22 (Tokyo)
Webinar: Q1 Member Update / Smart Manufacturing – January 30 & 31
Pan Pacific Microelectronics Symposium – February 5-8 (Kohala Coast, Hawaii)
2019 iNEMI Roadmap PEG Workshop & TWG Kick-Off meeting at APEX – February 25-26 (San Diego, California)
2017 iNEMI Technical Plan
iNEMI Sustainability Roadmap and Environmental Projects, IEEE SusTech 2017 (Phoenix, Arizona; November 12-14)
Article: Recycling Storage Devices (references iNEMI's Value Recovery project), Forbes online (November 18)
Webinar: Q4 iNEMI Member Update (November 20 & 21; members only, requires log-in)
Qualification Test Development for Creep Corrosion, Phase 3 EOP webinar (members only; requires log-in) (December 12)
Mark Your Calendars — Q1 Member Webinar
Features Special Presentation on Smart Manufacturing
iNEMI’s first quarter member webinar will include an invited presentation on smart manufacturing from Glenn Farris (Universal Instruments Corporation). Be sure to join us for this discussion, either on January 30 or 31 (two sessions scheduled). We’ll also be sharing information about the 2019 Roadmap and progress reports from iNEMI projects. (This meeting is members-only.) Additional information and registration.
PSMA Requests Input on Reliability Survey
Getting Power Reliability Back on Track
Historically, power supplies were frequently at the top of the list of causes of field failures of electronic systems. Component and design improvements reduced failures but that positive trend may be reversing. The Power Sources Manufacturers Association (PSMA) has formed a committee to assess this situation and identify ways to put power supply reliability back on a track of continuous improvement. Success will mean higher customer satisfaction and loyalty along with lower support costs for power supply manufacturers. The starting point for the Reliability Committee is to gather data on power supply reliability and the causes of failures, both in the factory and in the field. A simple survey will help set the priorities of the committee and establish the most appropriate next steps.

PSMA invites you to take this survey, which will be open until Friday, January 5. It should require only 6-8 minutes to complete. Take survey now.
New Project in Sign-Up
Wafer/Panel Level Package Flowability and Warpage
This new initiative aims to identify key processing parameters and factors that influence flowability and investigate the factors from flowability that impacts warpage. The group is currently working on a Statement of Work (SOW). More information and recent webinar presentation.
2019 Roadmap PEG Workshop & TWG Kick-Off Meeting Scheduled at APEX
February 25-26 / San Diego, California

The PEG Workshop & TWG Kick-Off meeting for the 2019 Roadmap will be held in conjunction with APEX EXPO 2018 on Sunday, February 25 (1:30-5:00 p.m. PST), and Monday, February 26 (8:00 a.m. - 5:00 p.m. PST). Meetings will be held in room 5B of the San Diego Convention Center. Additional information.

WebEx access is also provided for those unable to attend in person. Please contact Linda Wilson for details.

All iNEMI members are invited to attend and get involved in development of the 2019 Roadmap. This meeting formally starts the work of the TWG chapter planning by giving TWG chairs and participants information from the seven PEGs as to what to expect in the way of existing and new needs over the 10 years covered by the roadmap. We encourage all roadmap chairs and all members interested in finding out more about the roadmap to attend this meeting.
Recruiting PEG Leaders
We are recruiting for a few open Product Emulator Group (PEG) chairs. These leaders should come from OEM or Tier 1 suppliers, so they have knowledge of what is needed in the way of technical key attributes for their companies to be competitive in the world markets. We are looking for chairs and co-chairs for the following PEGs:
  • Automotive
  • Portable & Wireless
  • Consumer & Office
  • IoT
PEG Chairs do not need to be from member companies, but we would like to offer the opportunities to members before opening it up to others. Please contact Linda Wilson for more information about these leadership opportunities.
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