It is an honor and a privilege to serve you as iNEMI's fourth CEO. I am excited about how we, as an industry working together, can address the challenges and opportunities that face us. iNEMI’s history, under the leadership of my predecessors, has repeatedly shown that industry collaboration can accomplish amazing feats. Leveraging the expertise you all bring to a project has demonstrated we can create a virtual vertically integrated team, where we truly complement each other, and are able to address common gaps for our industry. It continues to be an exciting time for the electronics manufacturing industry, with no shortage of hot topics for our attention. I will personally be reaching out to all members to introduce myself and listening to your ideas/thoughts on what our priorities should be and how we can collectively address them.
ICEP-IAAC 2018(April 17-21; Kuwana, Mie, Japan): An iNEMI session at ICEP-IAAC (April 19) will feature four presentations from iNEMI projects. Two papers are from the SiP Moldability project, one is from the BiSn-Based Low-Temperature Solder project and the fourth is from the Inspection Capability of AXI for HiP Defects project.
OFC 2018(March 11-15; San Diego, CA): The iNEMI Optoelectronics Technology Integration Group (TIG), together with the AIM Photonics Academy, have scheduled a full-day session on March 12 at the OFC 2018 conference. All meetings are open to anyone interested in attending. iNEMI will review findings and results from its optoelectronics projects; and the AIM Photonics Academy will provide an overview of accomplishments and findings from the Integrated Photonic Systems Roadmap (IPSR), report on projects, and discuss plans for 2018. Get additional information.
Electronics in Harsh Environments Conference (April 24-26; Amsterdam): This conference, sponsored by SMTA Europe, tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. iNEMI is co-organizing the final conference session, which will focus on reliability in the automotive sector. Learn more online or contact Steve Payne (iNEMI) with questions or comments.
Phase 2 of this project will consist of specifying, designing, modeling, building and demonstrating a board-level optical interconnect system in which an expanded-beam optical connector interface will be developed for the chip module. Call for participation webinars are scheduled for February 21 & 22. Additional information.
The objective of the project will be to predict and understand functional performance of highly dense electronics in harsh environments through measurement of electrical and chemical effects under bottom terminated components.
GE and Kyzen are leading the development of the statement of work (SOW). We are seeking additional organizations to provide input into the scope of work. A call for participation webinar will be held on February 19. Please contact Mark Schaffer if you would like more information or want to participate in development of the SOW. Additional information.
Smart Manufacturing (Industry 4.0) content will be new to the 2019 Roadmap, either as part of the IoT PEG or as a stand-alone TWG. There will be a meeting the week of APEX to discuss the structure of the roadmap chapter and potential activities and projects for iNEMI in this area.
Be a Part of the Effort
Participating in the roadmap is open to all subject matter experts who have the expertise and are willing to commit a couple of hours a month to develop content with other team members, attend our roadmap meetings and webinars, and volunteer to write or review the team reports in a few months.