KYZEN Corporation. The first representative is Mike Bixenman; and the alternate representative is Tom Forsythe. KYZEN is a global leader in providing environmentally responsible, RoHS-compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications.
Momentum Technologies, Inc. The first representative is Preston Bryant. Momentum Technologies works with large electric vehicle manufacturers and ODMs to recycle their magnets for reuse. These high-powered magnets are made from Rare Earths. Using its exclusive recycling process developed by the U.S. Department of Energy, Momentum can economically recover the Rare Earths from electronic waste for reuse in wind turbines, electric cars, cell phones, hard drives, motors, sensors, speakers, and beyond.
COUNCIL OF MEMBERS MEETING SCHEDULED FOR APRIL 18
Mark your calendars for the Council of Members meeting on Wednesday, April 18, 11:00 a.m. - 12:30 p.m. EDT (North America) / 5:00-6:30 p.m. CEST (Central Europe).
This members-only webinar will review iNEMI's latest activities, including results of the Board of Directors election. Additionally, we will have a speaker discussing current issues and future trends in automotive electronics, plus a review of the information from the Automotive Chapter of the latest iNEMI Roadmap and plans for iNEMI's next phase of the Automotive Electronics for Harsh Environments Project.
Electronics in Harsh Environments Conference (April 24-26; Amsterdam) This conference, sponsored by SMTA Europe, tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. iNEMI is co-organizing the final conference session, which will focus on reliability in the automotive sector. Learn more online or contact Steve Payne (iNEMI) with questions or comments.
Call for Project Sign-Up Webinar: Wafer/Panel Level Package Flowability and Warpage
Mold flowability impacts the quality and potentially warpage of the wafer/panel for subsequent processes. The goal of this new iNEMI project is to identify key processing factors that impact flowability, establish factors from flowability that impact warpage, and identify other material factors that impact post mold warpage. This webinar will review plans for the project and is open to industry. Additional information.
End-of-Project Webinar: SiP Module Moldability
March 22 & 23
iNEMI's SiP Module Moldability Study Project has scheduled an end-of-project webinar for March 22 and 23. This project looked at mold resin flowability and warpage on SiP modules and will report on outcomes during this members-only webinar. Additional information & registration.
We had a productive set of meetings in San Diego during APEX, with updates from all the Product Emulator Groups (PEGs) on Day 1 and a response to those updates from the Technology Working Groups (TWGs) on Day 2. PEG chairs shared their teams' perspectives on current state, growth trends, key product attributes of their product sectors as well as next steps for producing their draft reports due in May. The TWGs discussed their scope of topics and roadmap plans. An important outcome from this meeting is the foundation of an integrated collaboration among all the teams. Other meeting outcomes were the understanding of critical messages from each team and gathering feedback from participants regarding the iNEMI roadmap topics.
Be a Part of the Effort
Interested in being a roadmap PEG or TWG team member? Participating in the roadmap is open to all subject matter experts that have the expertise and are willing to commit a couple of hours a month to develop content with other team members, attend our roadmap meetings and webinars, and volunteer to write or review the team reports in a few months.