Advancing Manufacturing Technology

March 2018 Newsletter
Thursday, March 1, 2018
Section: Monthly Newsletters

March 2018
For iNEMI Members Only

KYZEN Corporation. The first representative is Mike Bixenman; and the alternate representative is Tom Forsythe. KYZEN is a global leader in providing environmentally responsible, RoHS-compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications.


Momentum Technologies, Inc. The first representative is Preston Bryant. Momentum Technologies works with large electric vehicle manufacturers and ODMs to recycle their magnets for reuse. These high-powered magnets are made from Rare Earths. Using its exclusive recycling process developed by the U.S. Department of Energy, Momentum can economically recover the Rare Earths from electronic waste for reuse in wind turbines, electric cars, cell phones, hard drives, motors, sensors, speakers, and beyond.


Mark your calendars for the Council of Members meeting on Wednesday, April 18, 11:00 a.m. - 12:30 p.m. EDT (North America) / 5:00-6:30 p.m. CEST (Central Europe).

This members-only webinar will review iNEMI's latest activities, including results of the Board of Directors election. Additionally, we will have a speaker discussing current issues and future trends in automotive electronics, plus a review of the information from the Automotive Chapter of the latest iNEMI Roadmap and plans for iNEMI's next phase of the Automotive Electronics for Harsh Environments Project.

The webinar will be recorded for members who are unable to participate in the live event. Additional information & registration.

Meetings in Europe

Electronics in Harsh Environments Conference
(April 24-26; Amsterdam)

This conference, sponsored by SMTA Europe, tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. iNEMI is co-organizing the final conference session, which will focus on reliability in the automotive sector. Learn more online or contact Steve Payne (iNEMI) with questions or comments. 

ICEP-IAAC 2018 (April 17-21; Kuwana, Mie, Japan)
An iNEMI session at ICEP-IAAC (April 19) will feature presentations from four iNEMI projects.

Call for Project Sign-Up Webinar: Wafer/Panel Level Package Flowability and Warpage — March 14/15
AIM Photonics Webinar: What is an Application Interest Group (AIG)? — March 22
End-of-Project Webinar: SiP Module Moldability — March 22 & 23
Spring 2018 IPSR Meeting — March 26-27 (Cambridge, Massachusetts)
iNEMI Council of Members Meeting (webinar) — April 18
iNEMI Session at ICEP-IAAC 2018 — April 19 (Kuwana, Mie, Japan)
NEPCON China 2018 — April 24-26 (Shanghai)
Electronics in Harsh Environments Conference — April 24-26 (Amsterdam)
Medical Electronics Symposium — May 16-17 (Dallas)
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Statement of Work Overview Webinar: PCBA Cleanliness (February 19)
Call for Participation: iNEMI-IPSR Board-Level Optical Interconnect, Phase 2 (February 21 & 22)
Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test, presented by Prabjit Singh (IBM Corporation), APEX EXPO (February 2018)
Call for Project Sign-Up Webinar: Wafer/Panel Level Package Flowability and Warpage
March 14/15
Mold flowability impacts the quality and potentially warpage of the wafer/panel for subsequent processes. The goal of this new iNEMI project is to identify key processing factors that impact flowability, establish factors from flowability that impact warpage, and identify other material factors that impact post mold warpage. This webinar will review plans for the project and is open to industry. Additional information.
End-of-Project Webinar: SiP Module Moldability
March 22 & 23
iNEMI's SiP Module Moldability Study Project has scheduled an end-of-project webinar for March 22 and 23. This project looked at mold resin flowability and warpage on SiP modules and will report on outcomes during this members-only webinar. Additional information & registration.
News from PEG Workshop & TWG Kick-Off Meeting
We had a productive set of meetings in San Diego during APEX, with updates from all the Product Emulator Groups (PEGs) on Day 1 and a response to those updates from the Technology Working Groups (TWGs) on Day 2. PEG chairs shared their teams' perspectives on current state, growth trends, key product attributes of their product sectors as well as next steps for producing their draft reports due in May. The TWGs discussed their scope of topics and roadmap plans. An important outcome from this meeting is the foundation of an integrated collaboration among all the teams. Other meeting outcomes were the understanding of critical messages from each team and gathering feedback from participants regarding the iNEMI roadmap topics.
Be a Part of the Effort
Interested in being a roadmap PEG or TWG team member? Participating in the roadmap is open to all subject matter experts that have the expertise and are willing to commit a couple of hours a month to develop content with other team members, attend our roadmap meetings and webinars, and volunteer to write or review the team reports in a few months.

See a list of current PEGs and TWGs, as well as the roles and requirements for roadmap team participants.

If you're interested in getting involved in a PEG or TWG, please contact Linda Wilson.
2214 Rock Hill Road  Suite 110  Herndon  VA   20170-4214   USA