Advancing Manufacturing Technology

May 2018 Newsletter
Tuesday, May 1, 2018
Section: Monthly Newsletters

May 2018
For iNEMI Members Only

Echo Enviro
iNEMI would like to welcome Echo Environmental. The first representative is Mark Glick; and the alternate representative is Jennifer Wolf. Echo Environmental is an end-of-life recycler processing electronic waste. The company’s divisions service the electronics and scrap metals industries, as well as provide IT asset management. Its 175,000 square-foot facility in Carrollton, Texas, is designed to process scrap metal and precious-metal-bearing products from all types of industries.

Idaho Natl Lab

We also welcome Idaho National Laboratory (INL). The first representative is Daniel Ginosar; and the alternate representative is Ruby Thuy Nguyen. INL is part of the U.S. Department of Energy’s complex of national laboratories. The laboratory performs work in each of the strategic goal areas of DOE: energy, national security, science and environment. INL is the nation’s leading center for nuclear energy research and development and is managed by Battelle Energy Alliance for the Department of Energy’s Office of Nuclear Energy.


Finally, we welcome ZESTRON. The first representative is Sal Sparacino; and the alternate representative is Kathleen Pion. ZESTRON is a leading provider of high-precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries. With eight technical centers located throughout Europe, Asia and America, ZESTRON offers a wide range of cleaning process solutions for high tech industries where reliability is mandatory.


iNEMI’s paper on creep corrosion was named best presentation at Technology Conference Two, SMTA China East 2018 (April 25; Shanghai). “Qualification Test Development for Creep Corrosion Using Flower-Of-Sulfur (FOS) Chamber” was presented by Dem Lee of Integrated Service Technology Inc. (IST) on behalf of the iNEMI Creep Corrosion Project.

With the ever-rising pollution levels in some geographies, plus pressures to reduce data center energy consumption, corrosion of electronic hardware is having direct impact on equipment reliability. Creep corrosion is a common mode of corrosion-related hardware failure. In environments high in sulfur-bearing gaseous contamination, the extent of creep corrosion may be so high as to electrically short circuit adjacent pads and traces, causing circuit boards to malfunction.

The two obvious solutions to eliminating creep corrosion are: (1) chemically filter the air to reduce the corrosive-gaseous contamination levels to an acceptable limit, and (2) make the hardware more robust against creep corrosion. Chemical filtration is both expensive and impractical in data centers using airside economizers to reduce energy consumption. Therefore, it has become incumbent on PCB, assembly and component manufacturers to make their products robust and qualify their products to ensure they are not susceptible to creep corrosion.

The participants in iNEMI’s Creep Corrosion Project have developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. The iNEMI FOS chamber is a 300-mm cube acrylic sealed box containing flowers of sulfur as the source of sulfur gas, a saturated salt solution to maintain constant humidity and a household bleach as the source of chlorine gas. Details of the design, development and round-robin testing of the effectiveness of this test method is the subject of this paper.

Download paper and presentation.

Link to the information page of the Qualification Test Development for Creep Corrosion Project, Phase 3 to get additional information, including other papers and presentations.


Marie Cole (IBM) was elected by iNEMI members to serve another three-year term on the Board of Directors. Mark Morizio (Lenovo retired) was elected by the Board to serve as an Ex-officio member for a three-year term. Mark served on the iNEMI Board from 2012 until his retirement this year, first representing IBM and, later, Lenovo.


The Technology Working Groups (TWGs) of the 2019 iNEMI Roadmap plan to present the current (draft) state of their respective roadmap chapters through a series of regional webinars. Elements such as situational analyses, critical issues, technology needs, and recommendations regarding potential alternative technologies are some of the items these roadmap chapters contain. Webinar participants will have an opportunity to provide feedback to the draft content, as well as offer additional sources to enrich the information. This feedback allows us to ensure that technology projections are accurate, and that regional concerns and issues are included. The regional webinar schedule is as follows:

  • EMEA (Europe, Middle East and Africa): June 7
  • APAC (Asia Pacific): June 13

iNEMI members are invited to participate in these interim updates and, most importantly, to provide input directly to the TWG teams. Advance registration is required (see links above).


Follow-up webinar planned for June 12

iNEMI recently led the “Durability for Autonomous Vehicle Electronics – Meeting the Needs” panel session at SMTA’s Electronics Harsh Environments Conference in Amsterdam (April 24-26).

The panel discussed topics ranging from the impact that autonomous driving development will have on the traditional automotive manufacturing supply chain, to the need for new standards development and, of course, the requirements for higher levels of security. The longer use cycles expected of autonomous vehicles, where they could be running 24/7, as well as the electrification of such vehicles, has new implications for materials development and revision of traditional qualification methodologies.

The follow-on break-out sessions focused on three areas: (1) design needs for automotive electronics, (2) miniaturization and systems integration challenges, and (3) robustness validation for autonomous mission profiles. Key challenges identified include the impact of low standoff components on reliability and the need for cleaning; requirements for coatings and encapsulants for automotive applications; the need to understand the physics of failure better; and how to develop new models for these challenging autonomous applications.

Download iNEMI presentation from this session. 

follow-up webinar is being planned for June 12 to discuss potential project areas arising from this successful session.

Medical Electronics Symposium 2018 – May 16-17 (Dallas area)
Roadmap Webinar: EMEA (Europe, Middle East, Africa) – June 7
Roadmap Webinar: APAC (Asia Pacific) – June 13
End-of-Project Webinar: iNEMI-IPSR Board-Level Optical Interconnect Project – June 13 & 14
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Presentation: PCBA Cleanliness Call for Participation Webinar (April 16 & 17)
iNEMI Session at ICEP-IAAC 2018 (April 19; Kuwana, Mie, Japan)
Presentation: iNEMI Technology Roadmap on MEMS & Sensors, presented by Haley Fu, iNEMI, FlexJapan (April 20; Tokyo)
Read iNEMI’s latest roadmap article: “The Complicated, Expansive World of IoT: The fastest growing sector of electronics is desperate for communication standards,” Satish Parupalli (Intel) and Barbara Goldstein (NIST), Printed Circuit Design & Fab / Circuits Assembly magazine, pp 30-31, May 2018.
iNEMI Survey on New Package / Material Qualification Methodologies
Survey closes May 25

The iNEMI New Packaging Technology Qualification Methodology Project team is surveying the electronics industry to better understand:

  • what methodologies are currently used to qualify new package technologies and materials
  • how users' requirements are obtained to ensure that a robust qualification plan is generated

New package technologies and materials are typically qualified using procedures and test conditions based on previous experience. While this is important, it could result in overlooking new failure modes and/or new wear-out mechanisms, and not identify all reliability and quality risks. Furthermore, as device suppliers increasingly rely on OSAT (outsourced assembly & test) suppliers to develop and qualify new package technologies and materials, there is the concern that the requirements (e.g., application environments, use conditions) of all potential end users may not be included. 

This survey is intended to identify trends, as well as gaps, in qualification methodologies for new package technologies and materials. Based on this information, the project team will propose ways to address those gaps and will gather and document industry best practices.

We ask for your participation in this online survey. Results will be reported in a webinar when analysis is completed. Please take the survey here.

Project in Sign-Up: PCBA Cleanliness
Sign up by May 18

Current industry standards do not adequately address the cleanliness of residues trapped under bottom-terminated components. As a result, OEMs and EMS providers must develop their own guidelines and requirements to assure an acceptable level of cleanliness. The objective of iNEMI’s PCBA Cleanliness Project is to predict and understand functional performance of cleaning single-row QFN component packages (as a representative of low-clearance, leadless electronic packages) in harsh environments. The project team plans to measure electrical and chemical effects under bottom-termination components to establish correlations among electrical performance, cleaning methods and materials.

Webinars Scheduled to Report Project Results

iNEMI-IPSR Board-Level Optical Interconnect
June 13 & 14

The iNEMI-IPSR Board-Level Optical Interconnect Project is aligned with the American Institute for Manufacturing Integrated Photonics (AIM Photonics), iNEMI and the MIT MicroPhotonics Center. AIM’s Integrated Photonic Systems Roadmap (IPSR) and other industry roadmaps predict that silicon-photonics-based transceiver modules will provide the most cost-effective solutions for on-board interconnections in the future. However, before the anticipated cost benefits of silicon photonics can be realized, new high-performance and cost-effective solutions to optical packaging and connectorization must be developed.

This end-of-project webinar will review results of the project team’s Phase 1 efforts to design, assemble and test a prototype on-board fiber optic interconnection system based on silicon photonic transceiver modules, single-mode fiber cables, and expanded-beam optical connectors for the package, backplane, and front-plane interfaces. These webinars are open to industry. Get additional information, including link to registration.

Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 2
June 20 & 21

Expanded beam optical connectors use various techniques that diverge light into either a collimated or focused beam, which eliminates the need for physical contact between mating fibers. Unlike existing lensed transmitter and receiver devices and traditional MT interconnects, some expanded beam products are significantly less susceptible to the effects of contamination, promising cost savings for data center applications.

To date, no formal inspection contamination criteria have been adopted by the industry for any expanded beam connector. This webinar, which is open to industry, will review the project team’s recommendations for visual inspection criteria for expanded beam connectors with different technologies based on experimental and modeling data. Get additional information, including link to registration.
Please Join Us!

Interested in being a chair/co-chair or contributor for a roadmap chapter?  You will gain immediate benefit by helping to develop projections for the industry and will get the earliest possible insight months in advance of the roadmap release. Chapter chairs and co-chairs also receive a free copy of the full roadmap ($3500 value), and contributors receive a free copy of the chapter they work on ($500 value).

Participating in the roadmap is open to anyone within the electronics industry who has expertise in the subject matter covered by a chapter plus a willingness to commit a couple of hours a month to develop content with other team members, attend roadmap meetings and webinars, and volunteer to write or review the team reports in a few months.

See a list of current chapters, as well as the roles and requirements for roadmap team participants. If you’re interested in getting involved in the roadmap, please contact Linda Wilson.

IPSR Publishes 2017 Update

The Integrated Photonic Systems Roadmap (IPSR) has published an update for 2017. The 2017 edition features a new chapter on photonic sensors plus minor updates throughout. Download the 2017 IPSR.

The next complete update is targeted for the end of 2018, to be released in March 2019.

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