Advancing Manufacturing Technology

November 2018 Newsletter
Thursday, November 1, 2018
Section: Monthly Newsletters

November 2018
For iNEMI Members Only

Our new headquarters office is now officially open in North Carolina (see press release). Our new address and phone number are:
    3000 RDU Center Drive, Suite 220
    Morrisville, NC 27560 USA
    +1 984.333.0820

The initial staff located in the North Carolina office are Edward (Ed) Jollie, Director, Business Administration and Operations, and Kristin Christensen, Office Administrator. Both are new to iNEMI. Their contact information is as follows:

Kristen Christensen (
+1 984-333-0820

Ed Jollie (
+1 984-333-0818

We are very close to the Raleigh-Durham International Airport (RDU) and hope you will stop by our new headquarters any time you are in the Raleigh/Research Triangle Park area.

We’re looking for artwork. As of now, our walls are bare, and we’d like to enlist you, the members, to help decorate the new space. We are looking for photomicrographs from experimental work you may have done, especially anything related to iNEMI project work. We need high-resolution images that can be enlarged and hung on the walls. If you have any images you would like to submit, please forward those to Kristin. We will clearly acknowledge individuals and/or teams for the images we display.


iNEMI has added a Smart Manufacturing chapter to our upcoming 2019 iNEMI Roadmap. This new chapter, chaired by Dan Gamota (Jabil) and Ranjan Chatterjee (Cimetrix), will identify key gaps that are preventing the successful deployment of smart manufacturing within the electronics industry. We are also establishing a Smart Manufacturing Technology Integration Group (TIG), comprised of iNEMI members who will focus on identifying and prioritizing collaborative projects to help the industry move forward in this area.

Dan and Ranjan are involved with the upcoming SEMI workshop — Practical Implementations and Applications of Smart Manufacturing — in Milpitas, California, on November 28. They are leading Session 3: Data Flow Architecture at 1:00 p.m.

This workshop offers a great opportunity to identify not only technology gaps, but also potential collaborative projects to close those gaps. The workshop promises to be informative as well as interactive. Please consider attending or sending a colleague to the event.  Marc Benowitz will be attending this workshop. Email him if you’d like to set up a meeting at the event.

Smart Manufacturing TIG. We are looking for people from our membership to get involved with the new Smart Manufacturing TIG. If you or someone from your organization would like to be involved in our efforts to identify challenges and discuss potential solutions paths, please let us know. Also let us know if you are interested in getting involved with any new projects we launch in smart manufacturing. Click here to be sure you receive notices about our smart manufacturing activities.

Webinar: Packaging TIG Kick-Off Meeting — November 25/26
SEMI Smart Manufacturing Workshop: Practical Implementations and Applications of Smart Manufacturing – November 28 (Milpitas, California)

IPSR-International TWG Meetings — November 28 (MIT, Cambridge, Massachusetts, USA)

AIM Photonics Academy 2018 Fall Meeting – November 29-30 (MIT, Cambridge, Massachusetts, USA)

Green Electronics Council (GEC) Webinar: Technology for Public Health: Addressing Counterfeit Products — November 29

End-of-Project Webinar: Reuse & Recycling Metrics, Phase 2 – January 23 & 24, 2019

iNEMI Next-Generation Solder Materials Workshop at APEX 2019 — January 31, 2019 (San Diego, California, USA)
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Article: “Value Assessment,” Wayne Rifer, E-Scrap News, Fall 2018, pp. 58-62
Presentation: Eco-Impact Estimator, Phase 3 Call-for-Participation Webinar (October 17)
Presentation, IPSR 2018 Webinar Series: Highlights of the World Technology Mapping Forum, Prof. Ton Backx, Institute for Photonic Integration at Eindhoven University of Technology (October 18, 2018)
Presentation: Test, Inspection & Measurement TIG Overview (October 24; members only, requires log-in)
Presentation: Reuse and Recycling Metric, Phase 2 Project Summary, presented by Lisa Dender (IBM), Electronics Reuse Conference (October 29, 2018; Nashville, Tennessee)
Presentation: Value Recovery from Used Electronics, Phase 2 End-of-Project Webinar: Creating a Circular Economy for Hard Disk Drives — A Shared Vision (October 31 & November 1)
Presentation: Call-for-Participation Webinar: Packaging TIG (November 8 & 9; members only, requires log-in)
iNEMI at Going Green – CARE Innovation 2018
November 28; Vienna, Austria

Two iNEMI projects are presenting at the upcoming 
Going Green - CARE Innovation 2018 conference. Both are part of the Circularity Evaluations Session on Wednesday, November 28 (11:00-13:00; Room 8 –Sophie). 

Carol Handwerker (Purdue University) is presenting “Application of the Ostrom Framework to Support a Circular Economy for Used Electronics,” based on work by the Value Recovery from Used Electronics project. Lisa Dender (IBM) is presenting “A Practical Means for Assessing Circular Economic Value of an ICT Product” from the Reuse and Recycling Metrics project. See additional details

iNEMI Vice President Grace O’Malley will be attending. If you want to set up a meeting please email her.

Reuse and Recycling Metrics End-of-Project Webinar
January 23 & 24, 2019

Join us for the end-of-project webinar where the Reuse and Recycling Metrics team will review the metric they have developed, discuss what is next for the project, and tell you how you can assist in improving the metric going forward.

If you can't measure something, you can't manage it. The reuse and recycling metric tool developed by this project team will give you the ability to do both. It can be used to assess the end-of-life impacts at the design and material choice stage in product development, helping manufacturers make more informed decisions before a product is ever manufactured. The metric tool examines not only the impact of design choice and the material selection but also the economic value of what can be recovered (from reuse or recycling). The recovery readiness in the regions of the world where products are being sold is also part of the metric. If you have an excellent design but the region into which you are selling has no way of recovering the product, the manufacturer should be aware of that.

This reuse and recycling metric tool is being developed for industry use. Please click here if you would like to be a beta tester to help us ensure this tool meets industry needs, or if you are interested in using the tool once development is completed. If you have any questions, please email project manager Mark Schaffer.
2019 iNEMI Roadmap Update
Roadmap Is Nearing Completion

The roadmap chapters from the Product Emulators Groups (PEGs) and the Technology Working Groups (TWGs) are in various stages of completion. Our goal is to release the 2019 Roadmap to iNEMI members in late December or early January. It will go on sale to the public three months after the member release. Our final list of chapters for the 2019 iNEMI Roadmap is as follows:

PEGs (5)

  • Automotive
  • Aerospace & Defense
  • High-End Systems
  • Industrial Internet of Things (IIoT)
  • Medical 
TWGs (16)
  • Board Assembly
  • Ceramic Interconnect & Photovoltaics
  • Connectors
  • Flexible Hybrid Electronics
  • Mass Data Storage
  • MEMS & Sensors
  • Modeling, Simulation & Design Tools
  • Optoelectronics
  • Organic PCB
  • Packaging Substrates & Components
  • Passive Components
  • Power Conversion Electronics
  • Semiconductor Technologies
  • Smart Manufacturing
  • Sustainable Electronic
  • Thermal Managemen

This latest roadmap continues to assess the electronics industry’s readiness for the next industrial revolution of the “smarter” world (think Industry 4.0 for advanced manufacturing, as well as smart cities, autonomous vehicles, wearables, and advanced medical devices, etc.). While many of the more conventional component attributes extend into this realm, the roadmap also includes the growing challenges and recommendations of how to fill the gaps to address the complexity of data-driven manufacturing and technologies for electronic products, the new “consumer expected” applications that drive features, and the changing landscape of a personalized, connected world. New architectures and materials as well as a roadmap to maintain sustainability and eco-design builds for electronics are also discussed.

IPSR Update
Roadmap Meetings Scheduled at MIT November 28-30; Cambridge, Massachusetts

IPSR-International has scheduled a special technical and organization meeting for the Technology Working Groups (TWGs) at MIT on November 28. This organization brings together EU, US and Asia roadmap efforts under a single governance and reporting structure. Members of the Technical Working Groups (TWGs) from these constituencies will meet on Wednesday, November 28, to formally merge their TWGs and documents and create the initial structure for the global governance of this new organization.

Immediately following this meeting is the AIM Photonics Fall 2018 Roadmap Meeting: The Path to Commercial Success, November 29-30.
3000 RDU Center Drive  Suite 220  Morrisville  North Carolina   27560   United States