Advancing Manufacturing Technology

October 2017 Newsletter
Sunday, October 1, 2017
Section: Monthly Newsletters

October 2017
For iNEMI Members Only

All seven Technology Integration Groups (TIGs) have finished their technology plans for 2017, and these have been published for iNEMI members as the 2017 Technical Plan. Each TIG proposes projects that address gaps identified as critical in the 2017 iNEMI Roadmap, fit within the iNEMI scope of interest and have member support on the TIGs. The Technical Plan is a key element in project planning for the next two to five years, so please review it and determine which proposed projects you and your company might be interested in supporting. Since this is a members-only document, you will need to log into your iNEMI web account to access/download it. If you do not have an account, please set one up

The TIGs will allow members some time to evaluate the Technical Plan before recruiting member companies to begin helping form initiatives which will lead to projects. Of course, feel free to contact Grace O’Malley if you have an interest in forming a project initiative. 

Get the Technical Plan
Dr. Milena Vujosevic (Intel) will discuss challenges with traditional approaches for definition of qualification requirements for package certifications. She will also present information about a proposed methodology that leverages knowledge of use conditions and fundamental physics, and couples it with advanced computational mechanics modeling. Additional information & registration.
Work from several iNEMI projects will be showcased in an iNEMI session scheduled for October 27 (10:30 a.m. to noon) as part of the International Microsystems, Packaging, Assembly and Circuits Technology conference (October 25-27; Taipei Nangang Exhibition Center). Topics will include packaging, PCBs, and board assembly. IMPACT is organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA. This year’s theme is “IMPACT on Intelligent Everything.” We hope to see you there!
This is the last month to save on membership dues. Pay for 2018 dues by October 31 and save 5%. Pay for 2019 and save 10%. Download additional details. Please contact Linda Anderson-Jessup, iNEMI Membership Manager, if you would like to take advantage of the discount.
Webinar: Knowledge-Based Qualification - Meeting Challenges of New Markets and New Technologies – October 18/19
Call for Participation: Wafer/Panel Level Package Flowability and Warpage – October 25/26
iNEMI Session at 2017 IMPACT (Taipei, Taiwan) – October 27

Call for Participation: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 2 – October 31 & November 1

FUTURECAR 2017 (Atlanta, Georgia, USA) – November 8-10

IEEE SusTech 2017 (Phoenix, Arizona, USA) – November 12-14

Webinar: Q4 iNEMI Member Update – November 20 & 21

EcoDesign 2017 (Tainan, Taiwan) – November 29 – December 1

Mid-Project Webinar: Reuse and Recycling, Phase 2 – December 5

End-of-Project Webinar: Qualification Test Development for Creep Corrosion, Phase 3 – December 12/13


FUTURECAR copy.png
Presentation: SMTAI Luncheon Keynote – 2017 iNEMI Roadmap Highlights Impacting Board Assembly Over the Next 5-10 Years, Bill Bader (iNEMI)

iNEMI presentations at SMTA International (Rosemont/Chicago, Illinois, USA) – September 17-21

Presentation: Highlights of iNEMI 2017 Roadmap; presented by Steve Payne (iNEMI), ICT-Institute of Circuit Technology (September 19, 2017; Hayling Island, United Kingdom)

New Project Call-for-Participation Webinars

Wafer/Panel Level Package Flowability and Warpage (October 25/26)

This new initiative aims to identify key processing parameters and factors that influence flowability and investigate the factors that impact warpage. More information and registration.

Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology
(November 1 - two sessions)

This Phase 2 project will study inspection capability for fine pitch patterns with less than 10um line space with various defect patterns. The webinars will review the project background, objectives, scope and plan, as well as the sign-up steps. Additional information & registration.

Two New Projects in Sign-Up

Value Recovery from Used Electronics, Phase 2

This fast-turn project will focus on collaboration in hard disk drive design, reuse, remanufacturing, and materials and component recovery that enables a robust, sustainable circular supply economy for hard disk drives. More information

Eco-Design Best Practices Project 
Sign up by October 13

This fast-turn project will develop a white paper that elucidates how to maximize eco-design of electronic products when brand owners (OEMs) outsource product design to original design manufacturers (ODMs). The focus will be approximately 85% on products and no more than 15% on product packaging. Likewise, the white paper will emphasize eco-design principles and practices that go beyond what is regulated.  Sign up for this project by October 13.

Project Webinars Scheduled

End-of-Project Webinar: Final Assembly Automation and Optimization (November 2 - two sessions)

Join the leaders of the Final Assembly Automation and Optimization project as they present the key findings from this project that focused on cost, lead time and quality. Key process areas will be reviewed with an overview of the leading issues, best practices and troubleshooting guides as developed by the team. Information & registration.

Mid-Project Webinar: Reuse and Recycling Metrics, Phase 2 (December 5 - two sessions)

This project will report on work to date on its efforts to develop a scoring system (qualitative/semi-quantitative) that assesses the ability – economic feasibility and physical practicality – to separate and liberate materials from ICT products (product category specific). More information.

End-of-Project Webinar: Qualification Test Development for Creep Corrosion, Phase 3 (December 12/13)

This member-only webinar will present findings from the focused study of the effect of relative humidity on creep corrosion. Additional information.

Research Priorities Development Proceeding
Members of the iNEMI Research Committee continue their work on the 2017 Research Priorities. This document, which focuses on longer-term research, has developed a list of top research priorities in four categories: manufacturing, sustainable electronics, materials and reliability, and design. This document draws its strategic needs from the latest roadmap, as vetted by the iNEMI Technical Committee, and refined by iNEMI’s Technology Integration Groups (TIGs). The resulting prioritized and categorized needs are then made available to the supply chain to help focus research resources for suitable resolution of needs and/or gaps. We expect to publish this document in late October.
2019 Roadmap Cycle Launched
It seems like only yesterday that the 2017 iNEMI Roadmap was published and made available to the industry at large. Work is already beginning on the 2019 cycle with several preparatory meetings being held in mid- to late October. Since the seven PEG (Product Emulator Group) chapters drive the needs for the 21 TWG (Technology Working Group) chapters, the PEGs have a six-month head start so they can identify and forecast needs over a 10-year horizon.

We are recruiting for a few open PEG leadership opportunities, and we prefer that these leaders come from OEM or Tier 1 suppliers so they have knowledge of what is needed in the way of technical key attributes for their companies to be competitive in the world markets. Opportunities exist for chairs and co-chairs for: Automotive, Portable/Wireless (smart phones, tablets, etc.) and Consumer/Office PEGs. It is not necessary for PEG Chairs to be from member companies, but we would like to offer the opportunities to member companies first before opening them up to others. Please contact Chuck Richardson or Linda Wilson for more information on these leadership opportunities.
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