Advancing Manufacturing Technology

September 2017 Newsletter
Friday, September 1, 2017
Section: Monthly Newsletters

September 2017
For iNEMI Members Only
Help us welcome Linda Steele Wilson as our new Roadmap Manager. She replaces Chuck Richardson, who has headed iNEMI’s roadmapping efforts since 2006, and will continue working with iNEMI as a roadmap consultant.

Linda has impressive experience in technology roadmaps, as well as consortium-based activities, and will be a very strong addition to our team. The roadmap is critical, both in terms of setting direction for our own activities and for supporting the electronics manufacturing supply chain. We welcome Linda’s leadership in this area as we begin ramping up for the 2019 roadmap cycle. See bio.

We also want to thank Chuck for the way he has led the growth and development of the iNEMI technology roadmap over the past 11 years. His efforts in connecting experts across the globe and guiding them through the roadmap cycle to deliver the roadmap every two years have benefited not just iNEMI and its membership, but the electronics manufacturing industry at large. Many of you have worked with him over the years and, we are sure, join us in wishing him well.
Paul Wang (MiTAC International Inc.), reviews highlights from the Board Assembly chapter of the 2017 iNEMI Roadmap on Wednesday, September 13. Join us to learn what the future holds for board assembly. Additional details and registration.

iNEMI recently conducted a survey to assess current practices within the electronics industry for measuring polymer outgassing. Outgassing, or the release of gas from a solid material, can be a major concern with plastics and elastomers, causing problems with performance and precision. Understanding the characteristics of polymer outgassing from the materials and packaging used in electronics is critical to predicting failures and potential causes of those failures. Several techniques and metrologies are used to analyze outgassing.  This webinar will review the results of iNEMI’s survey and discuss plans for a new project to address this issue. Information & registration.

Don’t forget — there’s still time to save on dues. Pay for 2018 dues by October 31 and save 5%. Pay for 2019 and save 10%. Download additional details. Please contact Linda Anderson-Jessup, iNEMI Membership Manager, if you would like to take advantage of the discount.
Check Us Out at SMTAI (Chicago, Illinois)
iNEMI’s Bill Bader (CEO) and Grace O’Malley (Vice President) will be attending SMTAI in Chicago this September. If any iNEMI members want to meet on Monday, September 18, or Wednesday, September 20, please contact Grace O’Malley to schedule a time and place. Also, be sure to check out iNEMI presentations while you’re there.

See You at IMPACT 2017 (Taipei)
Work from several iNEMI projects will be showcased in an iNEMI session scheduled for October 27 (10:30 a.m. to noon) as part of the International Microsystems, Packaging, Assembly and Circuits Technology conference (October 25-27; Taipei Nangang Exhibition Center). Topics will include packaging, PCBs, and board assembly. IMPACT is organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA. This year’s theme is “IMPACT on Intelligent Things.” We hope to see you there!
Roadmap WebinarBoard Assembly Chapter – September 13
Call for Participation WebinarEco-Design Best Practices Project – September 13 & 14
iNEMI at SMTAI (Rosemont/Chicago, Illinois, USA) – September 17-21
Electronics Packaging Symposium (Niskayuna, New York, USA) – September 19-20
iNEMI Session at 2017 IMPACT (Taipei, Taiwan) – October 27
FUTURECAR 2017 (Atlanta, Georgia USA) – November 8-10
IEEE SusTech 2017 (Phoenix, Arizona, USA) – November 12-14
WebinarQ4 iNEMI Member Update – November 20 & 21
FUTURECAR copy.png

Press ReleaseiNEMI Names New Roadmap Manager

PresentationiNEMI Regional Member Meeting in Japan, hosted by Takaoka Toko; Tokyo, Japan (August 4, 2017)

PresentationQ3 iNEMI Member Update Webinar (August 28 & 29)

PresentationPackaging & Component Substrates Roadmap webinar

PresentationPCB/PCBA Material Characterization for Automotive Harsh Environments end-of-project webinar (September 7)


Flexible Hybrid Electronics Key to a Personalized Digital Future, by Daniel Gamota (Jabil)

Two New Projects in Sign-Up

Value Recovery from Used Electronics, Phase 2
Sign up by October 6

This fast-turn project will focus on collaboration in hard disk drive design, reuse, remanufacturing, and materials and component recovery that enables a robust, sustainable circular supply economy for hard disk drives. Project leaders William Olson (Seagate) and Carol Handwerker (Purdue University) presented the scope of work and other information about this project in a call-for-participation webinar last week. If you missed the webinar, you can download the presentation and watch the recorded session. 

Eco-Design Best Practices Project Call for Participation (September 13 & 14)
Sign up by October 13

This fast-turn project will develop a white paper that elucidates how to maximize eco-design of electronic products when brand owners (OEMs) outsource product design to original design manufacturers (ODMs). The focus will be approximately 85% on products and no more than 15% on product packaging. Likewise, the white paper will emphasize eco-design principles and practices that go beyond what is regulated. More information.

iNEMI Technical Plan Nearing Completion
The iNEMI Technical Plan proposes projects that address gaps identified as critical in the 2017 iNEMI Roadmap, fit within the iNEMI scope of interest, and have member support. This plan is a key element in iNEMI’s project planning for the next two to five years. We’ll notify you when this document is ready, and hope you’ll review it to determine which proposed projects you and your company might be interested in supporting. iNEMI’s Technology Integration Groups (TIGs) will be reaching out to recruit member companies to begin forming new projects. Of course, feel free to contact Grace O’Malley if you have an interest in forming a project initiative.
Research Priorities Development Proceeding
In parallel with the TIG efforts to develop the iNEMI Technical Plan, the Research Committee has been developing the 2017 Research Priorities. The Committee is voting on priorities to identify a list of top research priorities in four categories: Manufacturing, Sustainable Electronics, Materials and Reliability, and Design. Once the results are tabulated, they will be placed in the document along with a number of short whitepapers on various evolving, emerging and enabling technologies. This document draws its strategic needs from the latest roadmap, as vetted by the iNEMI Technical Committee, and refined by iNEMI’s TIGs. The Research Committee uses these inputs to prepare the biennial Research Priorities document. The resulting prioritized and categorized needs are then made available to the supply chain (on the public website) to focus research resources for suitable resolution of needs and/or gaps. We expect to publish this document in late September or early October.
iNEMI   2214 Rock Hill Road  Suite 110  Herndon  VA   20170-4214   USA