Don’t forget — there’s still time to save on dues. For calendar year membership terms, pay for 2019 dues by October 31, 2018 and save 5%. Pay for 2020 and save 10%. More information is available here. For those not on a calendar year term, similar discounts are available. Please contact Linda Anderson-Jessup, iNEMI Membership Manager, if you would like to take advantage of the discounts.
WELCOME TAMURA CORPORATION
We would like to welcome Tamura Corporation as our newest member. The first representative is Taku Ono; and the alternate representative is Naoki Kubota. The Tamura Group supplies an original range of products and services, highly regarded in the global electronics market, to satisfy the evolving needs of customers, employees and shareholders supporting the Group’s growth. Founded in 1924, it is one of Japan’s oldest electronics companies. Over the years, the company has developed a stream of products, including a wide variety of transformer-related products, electronic chemicals, reflow soldering systems, LED lights, broadcast audio mixing consoles, and wireless microphones. Today, the Tamura Group’s products include electronic components, information equipment, electronic chemicals/factory automation systems and single-crystal gallium oxide substrates.
CREEP CORROSION: ADDRESSING THE CHALLENGE
iNEMI began working on the creep corrosion problem in 2009 and has improved industry’s understanding of the factors affecting creep corrosion on PCBs and PCBAs, such as surface finishes, soldering fluxes, design features and the environment. Most recently, the iNEMI Qualification Test Development for Creep Corrosion project published information about a test the project team created to determine whether PCBAs are likely to develop creep corrosion. The innovative flowers-of-sulfur (FoS) corrosion chamber they developed is inexpensive and easy to maintain, and testing with this chamber has been successful in reproducing creep corrosion on PCBs from lots that are known to have suffered creep corrosion in the field.
The project team has published a white paper, highlighting some of the key findings from the project team’s extensive testing and describing the FoS test chamber developed. They have also published a full project report, which provides a more detailed and in-depth discussion.
The team reported on its work at a seminar held in Taipei September 7, and has scheduled two webinars later this month to review the FoS test developed. See links below to download reports and/or register for a webinar.
iNEMI’s Grace O’Malley will be at ESTC next week in Dresden. Send her an email (firstname.lastname@example.org) if you’d like to meet with her at the conference.
SMTA International (October 15-18; Rosemont, Illinois)
Marc Benowitz and Grace O’Malley will both be attending SMTAI this year. Please email if you would like to meet with either of them while at the conference. Also, be sure to check out the four iNEMI presentations on the technical program. Topics include: creep corrosion qualification test, iNEMI’s smart manufacturing roadmap, the influence of printed circuit board thickness on the thermal fatigue reliability of quad flat no-lead packages, and process development of BiSn-based low-temperature solder pastes. See the website for session dates and times.
New Project Forming on PCBA Materials for Harsh Environments
Sign up by September 28
iNEMI is organizing Phase 2 of the PCBA Materials for Harsh Environments project. While Phase 1 focused on automotive applications in harsh environments, Phase 2 will expand the focus to include other applications where electronics modules must operate in environments with elevated operating temperatures and humidity, often in conjunction with vibration and shock. The project will include PCB materials, such as multilayer laminates, and assembly materials, such as solder alloys and fluxes. Get additional information.
Connector Reliability Test Recommendations Team Schedules End-of-Project Webinar
Two sessions scheduled; members only
Session 1: October 17, 11:00 a.m. EDT (U.S.) Session 2: October 18, 9:00 a.m. CST (China)
The first phase of iNEMI’s Connector Reliability Test Recommendations Project reviewed current standards pertaining to connector reliability and surveyed industry to determine common metrics for connector reliability guidelines. In Phase 2, the project team defined specific test conditions to be used to evaluate the expected degradation of connectors used under different stress levels in specific application classes. This work could form the basis for standardized reliability test procedures for each application class. The project team will review Phase 2 results in this end-of-project webinar. For additional information.
Value Recovery from Used Electronics Project to Report Results
October 31 & November 2
This fast-turn project focused on collaboration in hard disk drive design, reuse, remanufactur-ing, and materials and component recovery to enable a robust and sustainable circular supply economy for hard disk drives. In its end-of-project webinar, the Phase 2 project team will review their work, focusing on each of five demonstration projects that were conducted to show how used hard drives can be turned back into hard drives. Project information and webinar registration.
Eco-Impact Evaluator, Phase 3 Now Forming
October 17, 2:00-3:00 p.m. EDT (U.S.)
This project will update and expand on iNEMI’s previously developed Eco-Impact Estimator, which enables efficient and accurate LCA (life cycle assessment) estimates for two key greenhouse gas emissions component categories: bare printed wiring boards and large integrated circuits. The overall objective for the Phase 3 project is to update the existing estimator and validate its accuracy. This approximately year-long effort will greatly enhance the estimator tool/framework for more general use, updating and expanding on the ICT components covered, and investigating inclusion of other environmental aspects such as energy and water usage. Additional project details, including webinar registration.
The final phase (review and publication preparation) of the 2019 Roadmap cycle has started with the Technical Committee (TC) review of chapter drafts. Reviewers focused on three main questions: (1) are there any critical gaps or overlaps in the content; (2) are there any critical issues relating to scope and linkages such as overlaps / duplication with other teams or key items other teams might cover; and (3) are there any other important issues, such as items that may impact the quality of the roadmap or other critical gaps in the overall approach to the report? For those reports yet to come in, PEG and TWG chairs discussed status and their plans and dates for final submission of drafts for TC review.
New for the 2019 Roadmap will be a brief summary (1-2 pages) of the key messages of each report:
What is new for the 2019 Roadmap ?
What are the key messages, such as top challenges, conclusions and recommendations?
What are the risks and challenges ?
The freeze date for report content and to submit final drafts is September 24.
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