Advancing Manufacturing Technology

Lead-Free Assembly Project Final Report (December 2003)
Wednesday, December 10, 2003
Section: Presentations & Reports




All files are downloadable PDFs, and most are very large files.
 
 
Appendices:
Appendix A: Melting characteristics of Sn-Pb-Bi and Sn-Ag-Cu alloys
Appendix B: Report on modeling and data requirements for lead-free soldering workshop
Appendix C: Recommended Practice Guide
Appendix D: Lead-free solder database
Appendix E: Assessment of data needed for modeling and ATC testing
Appendix F: Lead-free literature database
 
Process Group Report
 
 
 
 
NOTE:  the Lead-Free Assembly Project's final report is available to iNEMI members on CD.  If you would like to receive a copy, please contact Dee-Dee Taylor (+1 703-834-2087; dtaylor@inemi.org).