Advancing Manufacturing Technology

Pb-Free BGAs in SnPb Assemblies Final Report Results of Reliability Testing
Wednesday, September 10, 2008
Section: Presentations & Reports

Final Report:  Pb-Free BGAs in SnPb Assembly Process Project, presented by Robert Kinyanjui (Sanmina-SCI) and Quyen Chu (Jabil), August 28, 2008.

This webinar reported final results of the project's reliability testing of mixed-alloy solder joints.  The team completed 3500 cycles of accelerated thermal cycling (ATC) within a temperature range of -40°C and 125°C.