This iNEMI member meeting, hosted by Dow Chemical, was held in Tapei, Taiwan on October 21, 2014.
These presentations are for iNEMI Members only — requires account log-in; create account now.
iNEMI Update (Grace O'Malley, iNEMI)
Program Update (Haley Fu, iNEMI)
- Qualification Test Development for Creep Corrosion
- Warpage Characteristics of Organic Packages
- Ultra Low Loss Laminate and PCB
Disruptive Technologies for the Future Generation of Wearable Health Systems (Peter Lemmens, imec)
Members’ Companies Highlights
Lotes Connector Technologies (Bob Martinson, Lotes)
3D Printing & Additive Manufacturing (Benjamin Chen, UL)
Testing Service Platform in iST Group (Peggy Liou, iST)
Advances in Bonding Wires (Murali Sarangapani, Heraeus)
Highlights from 2014 iNEMI Workshops (Grace O'Malley, iNEMI)
iNEMI Asia Structure and Objectives (Haley Fu, iNEMI)
Wrap Up & End