Advancing Manufacturing Technology
iNEMI Member Meeting (Japan 2016)
Tokyo, Japan | February 19, 2016
Hitachi Chemical hosted this members’ meeting in Japan at their HQ office in Tokyo. Thirteen people attended the meeting. Five presentations were made by iNEMI members:
- Novel Conformal Organic Coating on Copper Surface, presented by Simon Lee (Dow Electronic Materials)
- Non-Contact Open Test Technology VTEP, presented by Koichi Wada (Keysight Technology)
- iNEMI Warm Assembly Initiatives, Kinya Ichikawa (Intel K.K.)
- Pros and Cons of Encapsulation Material for Warm Assembly, presented by Takahiro Horie (Hitachi Chemical Co., Ltd.)
- Laminate Material for Warm Assembly, presented by K. Oohashi (Hitachi Chemical Co., Ltd.)
- Possibility of Low Temp Pb-Free Solder, presented by Yoshikawa (Senju)
- iNEMI Project Updates
- 2017 iNEMI Roadmap Update and Schedule
- Automotive Survey Results
- Package/Substrate Technology Workshop in Singapore