Advancing Manufacturing Technology

iNEMI 3rd Quarter 2017 Member Webinar
August 29, 2017
Monday, September 11, 2017
Section: Presentations & Reports




Presentations

These topics are included:

Session 1
  • Introduction - Bill Bader, iNEMI
  • iNEMI Status and Calendar - Bill Bader, iNEMI
  • Deployment Status - David Godlewski, iNEMI
  • Technology Plan Status - Chuck Richardson, iNEMI
  • Packaging & Component Substrates TIG Status - Kyu-oh Lee, Intel
  • Member Packaging Update "eWLB FOWLP: Good to Great," Dr. Seung Wook Yoon, STATS ChipPAC
Session 2
  • Introduction - Grace O'Malley, iNEMI
  • iNEMI Status and Calendar - Grace O'Malley, iNEMI
  • Deployment Status - David Godlewski, iNEMI
  • Technology Plan Status - Chuck Richardson, iNEMI
  • Packaging & Component Substrates TIG Status - Chuck Richardson, iNEMI
  • Member Packaging Update "eWLB FOWLP: Good to Great," Dr. Seung Wook Yoon, STATS ChipPAC