Advancing Manufacturing Technology

iNEMI Session at IMPACT 2017
Taipei, Taiwan | October 27, 2017
Monday, November 6, 2017
Section: Presentations & Reports




iNEMI Session 
October 27, 2017

Introduction and Agenda, Haley Fu (iNEMI)

Study of SiP Module Moldability, Chih Chung Hsu (CoreTech Systems)

iNEMI Ultra Low Loss Laminate/PCB for High Reliability & Performance, John Lin (Lenovo)

BiSn-Based Low Temperature Soldering Process and Reliability, Haley Fu (iNEMI)