Advancing Manufacturing Technology

Taipei, Taiwan | October 26, 2012
Monday, November 5, 2012
Section: Presentations & Reports

Introduction and Agenda
Haley Fu, iNEMI

2013 iNEMI Technology Roadmap Highlights
Bill Bader, iNEMI

Thermal Fatigue Results for Low and No-Ag Alloys
William Chao, Cisco

BFR-Free PCB for High-Reliability Products
Michael Roesch, HP

Counterfeit Components - Impact and Mitgation
Jeffrey Lee, IST-Integrated Service Technology Inc.

Current and Future Test Solution Strategies
Eugene Lin, Agilent Technologies