Advancing Manufacturing Technology

Impact of low CTE mold compounds on first- and second-level interconnect reliability
Saturday, March 2, 2013
Section: Presentations & Reports




Impact of Low CTE Mold Compounds on First- and Second-Level Interconnect Reliability, webinar presented by imec (February 27, 2013).

Impact of Green Mold Compounds on First-and Second-Level Interconnect Reliability, webinar presented by imec (January 30, 2013).

Recording of January 30, 2013