Advancing Manufacturing Technology

iNEMI delivers keynote at NMI
Cambridge, UK | May 26, 2011
Monday, May 30, 2011
Section: Presentations & Reports

Grace O’Malley (iNEMI) delivered the keynote address at the NMI (National Microelectronics Institute) IC Packaging Innovation forum at TWI in Cambridge, UK, on May 26, “Technology Trends & Roadmaps for Package Innovation."  This presentation highlighted the findings of the Packaging and Component Substrates chapter of the 2011 iNEMI Roadmap.