Advancing Manufacturing Technology

iNEMI Board Flexure Standardization Project End-of-Project Webinar
Saturday, January 30, 2010
Section: Webinars

Project Chair:  Rosa Reinosa (Hewlett-Packard)
Project Co-Chair:  Alan McAllister (Intel Corporation)

Presentation:  End of Project Webinar:  Board Flexure Standardization Project, presented by Aileen Allen (Hewlett-Packard); January 20, 2010

An overview of the results of this project's efforts were will be covered in this webinar and is open to all iNEMI members.  This group's objective was to promote and expand the use of standard test methods to characterize board level interconnects.  Key focus area for the phase 1 is the development of new spherical transient bend test method to establish strain limits for lead free printed circuit boards.

Lead free boards are more susceptible to mechanical stresses and therefore more prone to damage when bent.  These efforts resulted in the development of a new standard IPC/JEDEC-9707 (Spherical Bend Test Method for Characterization of Interconnects).

For further information
David Godlewski
+1 717-651-0522