Characterization of Pb-Free Alloy Alternatives, Phase 1
12/7/2022
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Characterization of Third Generation High-Reliability Pb-Free Alloys
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5/13/2021

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Related Articles:
Pb-Free Alloy Alternatives
Pb-Free BGAs in SnPb Assemblies
Pb-Free Component & Board Finish Reliability
Pb-Free Early Failure, Phase 2
Pb-Free Nano-Solder
Pb-Free Rework Optimization, Phase 3
Characterization of Pb-Free Alloy Alternatives, Phase 1
This initiative is a follow-on to the Pb-Free Alloy Alternatives Project. The project team is now working on characterization of Pb-free alloy alternatives, with two main thrusts: (1) characterize the thermal fatigue and acceleration behavior of alternative alloys through accelerated thermal cycle testing, and (2) develop a set of test data requirements that will allow OEMs and others to evaluate alloy properties against their requirements.
Pb-Free Alloy Alternatives
by:

12/7/2022

0 Comments

Related Articles:
Characterization of Third Generation High-Reliability Pb-Free Alloys
Pb-Free BGAs in SnPb Assemblies
Pb-Free Component & Board Finish Reliability
Pb-Free Early Failure, Phase 2
Pb-Free Nano-Solder
Pb-Free Rework Optimization, Phase 3
Solder Paste Deposition
Strain Guidance for PCBAs
Characterization of Pb-Free Alloy Alternatives, Phase 1
mmWave Permittivity Reference Material Development
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4/4/2022

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Related Articles:
5G/mmWave Materials Assessment and Characterization
5G/6G MAESTRO
The goal of this project is to develop and characterize suitable reference material(s) for consistent Df/Dk measurement methodologies for characterizing ultra low loss laminate materials. The team plans to develop a requirements document describing the physical and electrical requirements needed to make a traceable permittivity reference sample useful to industry for calibration of high frequency dielectric characterization spanning 10 GHz to 100 GHz.