Advancing Manufacturing Technology

Characterization of Third Generation High-Reliability Pb-Free Alloys
5/13/2021
This initiative is a follow-on to the Pb-Free Alloy Alternatives Project. The project team is now working on characterization of Pb-free alloy alternatives, with two main thrusts:
-The first is to characterize the thermal fatigue and acceleration behavior of alternative alloys through accelerated thermal cycle testing.
-The second is to develop a set of test data requirements that will allow OEMs and others to evaluate alloy properties against their requirements.
Sections
5G Electronics
Alternative Energy
Automotive Electronics
Former TIGS
MEMS Technology
Optoelectronics TIG
PCB & Laminates TIG
Sustainable Electronics TIG
Board Assembly TIG
Medical Electronics TIG
Miscellaneous
Packaging TIG
Smart Manufacturing TIG
Test, Inspection & Measurement TIG
Custom Content 1
Custom Content 1 Custom Content 1 Custom Content 1 Custom Content 1 Custom Content 1 Custom Content 1 Custom Content 1 Custom Content 1 Custom Content 1 ​Custom Content 1 Custom Content 1 Custom Content 1 Custom Content 1 Custom Content 1 ​Custom Content 1 Custom Content 1 Custom Content 1 Custom Content 1 Custom Content 1 ​Custom Content 1
Custom Content 2
Custom Content 2 Custom Content 2 Custom Content 2 ​Custom Content 2 Custom Content 2 Custom Content 2 ​Custom Content 2 ​Custom Content 2 Custom Content 2 Custom Content 2 Custom Content 2 ​Custom Content 2 ​Custom Content 2 Custom Content 2 ​Custom Content 2 ​Custom Content 2 Custom Content 2 Custom Content 2 Custom Content 2 ​Custom Content 2 ​Custom Content 2 Custom Content 2 ​Custom Content 2 ​Custom Content 2
5G/mmWave Materials Assessment and Characterization
by:

2/7/2021

0 Comments

The goal of this project is to develop a guideline/best practice for a standardized measurement and test methodology that can be shared with industry and relevant standards organizations. Initial focus will be to benchmark current available test methods and provide pro/con analysis, identify gaps (if any) for extending test methods to 5G/mmWave frequencies, as well as develop reliable reference standard materials for set-up and calibration.

The project will have two distinct phases:

Phase 1: Develop technical guidelines and generate best practices for characterization of ultra-low loss laminate materials in the range of 5-100 GHz

Phase 2: Extend the guidelines to PCB/substrate level characterization
1st Level Interconnect Void Characterization
by:

3/12/2021

0 Comments

Packaging 101
by: Cynthia Williams

9/23/2021

0 Comments

Related Articles:
Impact of Low CTE Mold Compound on Second-Level Board Reliability Project, Phase 2
New Packaging Technology Qualification Methodology
Package Warpage Prediction and Characterization
Featured Text