Conformal Coating Evaluation for Improved Environmental Protection, Phase 2
3/23/2021
In Phase 2, the team will compare the performance of conformal coatings exposed to the flowers-of-sulfur (FoS) environment to those exposed to a mixed flowing gas (MFG) environment.
Sections
5G Electronics
Optoelectronics
PCB & Laminates
Sustainable Electronics
Board Assembly
Packaging
Smart Manufacturing
Projects

In Progress
In Development
Completed
 

Low Temperature Material for 1st Level Interconnect
by:

2/14/2022

0 Comments

Related Articles:
1st Level Interconnect Void Characterization, Phases 1 & 2
1st Level Interconnect Void Characterization, Phases 1 & 2
by:

3/12/2021

0 Comments

Related Articles:
Low Temperature Material for 1st Level Interconnect
This project is studying voids in flip chip interconnect to determine their location and volume. It will also seek to understand how voiding in 1st level interconnect affects product reliability and what level of voiding is acceptable while maintaining reliability requirements.
5G/mmWave Materials Assessment and Characterization
by:

2/7/2021

0 Comments

Related Articles:
mmWave Permittivity Reference Material Development
This project was organized to develop guidelines/best practices for a standardized measurement and test methodology for 5G/mmWave frequencies that can be shared with industry and relevant standards organizations. The project team conducted three major studies and published a report on each: (1) benchmark current industry best practices for low loss measurements, (2) benchmark emerging industry best practices for low loss measurements and (3) determine measurement accuracies of commercial resonator-based techniques,