Section: Board Assembly
Characterization of Pb-Free Alloy Alternatives, Phase 1
Characterization of Third Generation High-Reliability Pb-Free Alloys
This initiative is a follow-on to the Pb-Free Alloy Alternatives Project. The project team is now working on characterization of Pb-free alloy alternatives, with two main thrusts: (1) characterize the thermal fatigue and acceleration behavior of alternative alloys through accelerated thermal cycle testing, and (2) develop a set of test data requirements that will allow OEMs and others to evaluate alloy properties against their requirements.
Pb-Free Alloy Alternatives
Connector Reliability Test Recommendations, Phase 3
This project proposes a proof-of-concept of the methodology defined in Phases 1 and 2, inclusive of defining a test vehicle and evaluating its response to the proposed test framework.
PCBA Materials for Harsh Environments, Phase 2
Phase 2 of the project plans to develop a common test vehicle(s) to accurately reflect typical DUT (device under test) modules, and to validate or develop pass/fail criteria. Additionally, this phase will review standards and test methodology requirements for PCBA materials in other industry sectors that also require high reliability and durability in harsh environments, such as aerospace.
Pb-Free Early Failure, Phase 2
Pb-Free BGAs in SnPb Assemblies
Strain Guidance for PCBAs
Test Strategy
Creep Corrosion, Investigation of Factors that Influence Creep Corrosion, Phase 3
Qualification Test Development for Creep Corrosion, Phase 1
Conformal Coating Evaluation for Improved Environmental Protection, Phase 1
This iNEMI project team developed a method for testing conformal coating that can be completed in a week compared to the months previously required to determine the mean time to failure. The team also investigated the impact of temperature and humidity on corrosion rates of conformally coated test coupons compared to uncoated ones
PCBA Cleanliness
Counterfeit Components - Assessment Methodology and Metric Development
High Density Interconnect Socket Warpage Prediction and Characterization, Phase 1
Electromigration of SnBi Solder for Second-Level Interconnect
BiSn-Based Low-Temperature Soldering Process and Reliability
The purpose of this project is to assess the surface mount processibility and reliability of the solder joints formed when enhanced BiSn-based solder pastes are used for assembling electronic components on printed circuit boards.
PCBA Reliability Qualification Project
AI Enhancement to AOI for PCBA Project, Phase 2
High Density Interconnect Socket Warpage Prediction and Characterization, Phase 2
Board Assembly Tech Topic Series
AI Enhancement to AOI for PCBA Project
Pb-Free Nano-Solder
QFN Package Board Level Reliability
The focus of this project is to isolate the effects of several key parameters on thermal cycle reliability of a large body QFN package.
Ultra Low Loss Laminate/PCB for High Reliability and Performance Project
Qualification Test Development for Creep Corrosion, Phase 3: The Effect of Relative Humidity on Creep Corrosion
PCB Warpage Characterization and Minimization Project
Connector Reliability Test Recommendations
Conformal Coating Evaluation for Improved Protection against Corrosive Environments, Phase 3
Conformal Coating Evaluation for Improved Environmental Protection, Phase 2
In Phase 2, the team compared the performance of conformal coatings exposed to the flowers-of-sulfur (FoS) environment to those exposed to a mixed flowing gas (MFG) environment.