This initiative is a follow-on to the Pb-Free Alloy Alternatives Project. The project team is now working on characterization of Pb-free alloy alternatives, with two main thrusts:
-The first is to characterize the thermal fatigue and acceleration behavior of alternative alloys through accelerated thermal cycle testing.
-The second is to develop a set of test data requirements that will allow OEMs and others to evaluate alloy properties against their requirements.
The purpose of this project is to assess the surface mount processibility and reliability of the solder joints formed when enhanced BiSn-based solder pastes are used for assembling electronic components on printed circuit boards.