iNEMI

Section: Board Assembly

High Density Interconnect Socket Warpage Prediction and Characterization, Phase 2

by:

12/7/2022

0 Comments

AI Enhancement to AOI for PCBA Project, Phase 2

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6/20/2023

0 Comments

AI Enhancement to AOI for PCBA Project

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12/7/2022

0 Comments

Creep Corrosion: Investigation of Factors that Influence Creep Corrosion

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6/19/2020

0 Comments

Conformal Coating Evaluation for Improved Environmental Protection, Phase 2

In Phase 2, the team compared the performance of conformal coatings exposed to the flowers-of-sulfur (FoS) environment to those exposed to a mixed flowing gas (MFG) environment.

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3/23/2021

0 Comments

Ultra Low Loss Laminate/PCB for High Reliability and Performance Project

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1/6/2022

0 Comments

Counterfeit Components - Assessment Methodology and Metric Development

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12/7/2022

0 Comments

Pb-Free Alloy Alternatives

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12/7/2022

0 Comments

BiSn-Based Low-Temperature Soldering Process and Reliability

The purpose of this project is to assess the surface mount processibility and reliability of the solder joints formed when enhanced BiSn-based solder pastes are used for assembling electronic components on printed circuit boards.

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3/3/2021

0 Comments

Characterization of Pb-Free Alloy Alternatives, Phase 1

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12/7/2022

0 Comments

Characterization of Third Generation High-Reliability Pb-Free Alloys

This initiative is a follow-on to the Pb-Free Alloy Alternatives Project. The project team is now working on characterization of Pb-free alloy alternatives, with two main thrusts: (1) characterize the thermal fatigue and acceleration behavior of alternative alloys through accelerated thermal cycle testing, and (2) develop a set of test data requirements that will allow OEMs and others to evaluate alloy properties against their requirements.

by:

5/13/2021

0 Comments

Connector Reliability Test Recommendations, Phase 3

This project proposes a proof-of-concept of the methodology defined in Phases 1 and 2, inclusive of defining a test vehicle and evaluating its response to the proposed test framework.

by:

3/17/2021

0 Comments

PCBA Materials for Harsh Environments, Phase 2

Phase 2 of the project plans to develop a common test vehicle(s) to accurately reflect typical DUT (device under test) modules, and to validate or develop pass/fail criteria. Additionally, this phase will review standards and test methodology requirements for PCBA materials in other industry sectors that also require high reliability and durability in harsh environments, such as aerospace.

by:

5/13/2021

0 Comments

Pb-Free Early Failure, Phase 2

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12/7/2022

0 Comments

Pb-Free BGAs in SnPb Assemblies

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12/7/2022

0 Comments

Strain Guidance for PCBAs

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12/7/2022

0 Comments

Test Strategy

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12/7/2022

0 Comments

Qualification Test Development for Creep Corrosion, Phase 1

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7/22/2015

0 Comments

Conformal Coating Evaluation for Improved Environmental Protection, Phase 1

This iNEMI project team developed a method for testing conformal coating that can be completed in a week compared to the months previously required to determine the mean time to failure. The team also investigated the impact of temperature and humidity on corrosion rates of conformally coated test coupons compared to uncoated ones

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1/6/2022

0 Comments

PCBA Cleanliness

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1/6/2022

0 Comments

High Density Interconnect Socket Warpage Prediction and Characterization, Phase 1

by:

8/26/2020

0 Comments

PCBA Reliability Qualification Project