Advancing Manufacturing Technology

Section: Board Assembly TIG
Characterization of Third Generation High-Reliability Pb-Free Alloys
This initiative is a follow-on to the Pb-Free Alloy Alternatives Project. The project team is now working on characterization of Pb-free alloy alternatives, with two main thrusts:
-The first is to characterize the thermal fatigue and acceleration behavior of alternative alloys through accelerated thermal cycle testing.
-The second is to develop a set of test data requirements that will allow OEMs and others to evaluate alloy properties against their requirements.
BiSn-Based Low-Temperature Soldering Process and Reliability
The purpose of this project is to assess the surface mount processibility and reliability of the solder joints formed when enhanced BiSn-based solder pastes are used for assembling electronic components on printed circuit boards.