Automotive Electronic Material Challenges
Anitha Sinkfield (Delphi)
Co-Chair: Anil Kurella (Intel)
Project Statement and Statement of Work
Automobiles are incorporating more and more electronics from various industry sectors that have not been optimally designed for use inside the passenger compartment. The conditions therein include thermal cycles, shock, vibration and heat aging with reliability expectations beyond typical consumer electronics (10–20 years).
The drive for miniaturization coupled with automotive reliability expectations requires better understanding of material properties beyond standard bulk analysis.
Consumer electronics (e.g., cameras, capacitive touch, curved displays) are moving into the automotive space and are not really designed for the passenger compartment environment (e,g., thermal cycling, humidity, S+V...)
Some higher end use electronics (radar, GPS/Navigation) from military-level applications are moving into non-military automotive vehicles as well.
We will measure functional performance of small geometries through understanding a combination of material properties and interface properties. Gaps and recommendations will be identified and closed, where possible in the project timeframe.
The end goal is to have the necessary information to predict reliability of technology to reduce design cycles. This would optimize reliability and reduce costs for the industry as a whole.
Automotive Electronic Material Challenges, Anitha Sinkfield, Delphi, IMAPS Automotive Microelectronics and Packaging Conference (June 3-4, 2015; Dearborn, MI)
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