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Impact of PCB Manufacturing, Design and Material on PCB Warpage

The smaller form factors and finer pitches found in today’s electronic products are driving the use of smaller components and thinner PCBs [1-3], which has led to PCB warpage issues in the surface assembly process. Warpage can negatively impact yield during the SMT process when the PCB experiences peak SAC soldering temperatures in excess of 240°C, creating potential solder joint reliability issues. Design is one way to control PCB warpage, but materials, thickness, post manufacturing bake, and different PCB processing conditions can also influence warpage.

Very little work has been published evaluating the impact of fabrication on PCB warpage. iNEMI’s PCB Warpage Characterization and Minimization Project was organized to further investigate ways to control warpage. The was divided into four phases as summarized in Figure 1.

By Antonio Caputo, Intel on June 25, 2020 10:29:38 PM EDT