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iNEMI Project Recommends Methodology for Qualifying New Packaging Technologies

Several recent developments in the electronics manufacturing supply chain are posing challenges for companies needing to qualify new packaging technologies and materials. These include:
Curtis Grosskopt & Feng Xue, IBM
By Curtis Grosskopt & Feng Xue, IBM
on June 25, 2020 10:27:22 PM EDT
   
iNEMI Project Recommends Methodology for Qualifying New Packaging Technologies
Several recent developments in the electronics manufacturing supply chain are posing challenges for companies needing to...
Curtis Grosskopt & Feng Xue, IBM
By Curtis Grosskopt & Feng Xue, IBM
on June 25, 2020 10:27:22 PM EDT
Written by

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